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參數資料
型號: S29GL032M10FAIR43
廠商: SPANSION LLC
元件分類: PROM
英文描述: CAPACITOR TANT 330UF 4V 20% SMD
中文描述: 2M X 16 FLASH 3V PROM, 100 ns, PBGA64
封裝: 13 X 11 MM, FORTIFIED, BGA-64
文件頁數: 5/116頁
文件大小: 6024K
代理商: S29GL032M10FAIR43
100
S29GL-M MirrorBitTM Flash Family
S29GL-M_00_B8 February 7, 2007
Data
Sheet
Physical Dimensions
TSR040—40-Pin Standard and Reverse Thin Small Outline Package (TSOP)
-X-
X = A OR B
e/2
DETAIL B
c
L
0.25MM (0.0098") BSC
0
DETAIL A
R
GAGE LINE
PARALLEL TO
SEATING PLANE
b
b1
(c)
7
6
c1
WITH PLATING
BASE METAL
7
C A-B S
M
0.08MM (0.0031")
SECTION B-B
e
0.10 C
A2
PLANE
SEATING
C
A1
SEE DETAIL B
B
SEE DETAIL A
2
REVERSE PIN OUT (TOP VIEW)
2
N
+1
N
1
4
3
A
-A-
-B-
5
9
E
5
D1
D
6
2
3
4
5
7
8
9
TSR 040
MO-142 (B) EC
40
MIN
0.05
0.95
0.17
0.10
18.30
19.80
0.50
0
0.08
9.90
0.50 BASIC
MAX
0.15
1.20
0.27
0.16
0.21
5
0.20
18.50
10.10
0.70
20.20
0.23
1.05
0.20
1.00
0.22
18.40
20.00
0.60
3
10.00
NOM
Symbol
Jedec
Package
b1
A2
A1
A
D
L
e
E
D1
b
c1
c
0
R
N
1
NOTES:
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (MM).
(DIMENSIONING AND TOLERANCING CONFORMS TO ANSI Y14.5M-1982)
NOT APPLICABLE.
PIN 1 IDENTIFIER FOR REVERSE PIN OUT (DIE DOWN), INK OR LASER MARK.
TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS DEFINED AS THE PLANE OF
CONTACT THAT IS MADE WHEN THE PACKAGE LEADS ARE ALLOWED TO REST FREELY ON A FLAT
HORIZONTAL SURFACE.
DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTUSION IS
0.15MM (.0059") PER SIDE.
DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE DAMBAR PROTUSION SHALL BE
0.08 (0.0031") TOTAL IN EXCESS OF b DIMENSION AT MAX. MATERIAL CONDITION. MINIMUM SPACE
BETWEEN PROTRUSION AND AN ADJACENT LEAD TO BE 0.07 (0.0028").
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10MM (.0039") AND
0.25MM (0.0098") FROM THE LEAD TIP.
LEAD COPLANARITY SHALL BE WITHIN 0.10MM (0.004") AS MEASURED FROM THE SEATING PLANE.
DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
3324 \ 16-038.10a
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