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參數(shù)資料
| 型號： | SIGC144T170R2C |
| 廠商： | INFINEON TECHNOLOGIES AG |
| 英文描述： | IGBT Chip in NPT-technology |
| 中文描述： | 在不擴(kuò)散核武器條約IGBT芯片技術(shù) |
| 文件頁數(shù)： | 1/4頁 |
| 文件大小： | 79K |
| 代理商： | SIGC144T170R2C |
SIGC144T170R2C
Edited by INFINEON Technologies AI PS DD HV3, L 7361M, Edition 2, 04.09.2003
IGBT Chip in NPT-technology
FEATURES:
1700V NPT technology
280μm chip
short circuit prove
positive temperature coefficient
easy paralleling
Chip Type
This chip is used for:
chip only
Applications:
drives
G
C
E
V
CE
I
Cn
Die Size
Package
Ordering Code
Q67041-A4696-
A001
SIGC144T170R2C
1700V
75A
11.98 x 11.98 mm
2
sawn on foil
MECHANICAL PARAMETER:
Raster size
11.98 x 11.98
Area total / active
143.52 / 113.6
Emitter pad size
8
x
( 1.98x2.98 )
Gate pad size
0.757 x 1.48
mm
2
Thickness
280
μm
Wafer size
150
mm
Flat position
90
deg
Max.possible chips per wafer
93 pcs
Passivation frontside
Photoimide
Emitter metalization
3200 nm Al Si 1%
Collector metalization
1400 nm Ni Ag –system
suitable for epoxy and soft solder die bonding
Die bond
electrically conductive glue or solder
Wire bond
Al,
≤
500μm
Reject Ink Dot Size
0.65mm ; max 1.2mm
Recommended Storage Environment
store in original container, in dry nitrogen,
< 6 month at an ambient temperature of 23°C
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| SIGC144T170R2C_09 | 制造商:INFINEON 制造商全稱:Infineon Technologies AG 功能描述:IGBT Chip in NPT-technology 1700V NPT technology 280 μm chip |
| SIGC14T60NC | 制造商:INFINEON 制造商全稱:Infineon Technologies AG 功能描述:IGBT Chip in NPT-technology |
| SIGC14T60SNC | 制造商:INFINEON 制造商全稱:Infineon Technologies AG 功能描述:IGBT Chip in NPT-technology 600V NPT technology 100μm chip short circuit prove |
| SIGC156T120R2C | 制造商:INFINEON 制造商全稱:Infineon Technologies AG 功能描述:IGBT Chip in NPT-technology |
| SIGC156T120R2CL | 制造商:INFINEON 制造商全稱:Infineon Technologies AG 功能描述:IGBT Chip in NPT-technology |
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