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參數資料
| 型號： | TFP513PAPG4 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 消費家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, PQFP64 |
| 封裝： | 10 X 10 MM, 1.00 MM HEIGHT, 0.50 MM PITCH, HTQFP-64 |
| 文件頁數： | 18/32頁 |
| 文件大小： | 1206K |
| 代理商： | TFP513PAPG4 |
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TFP513
TI PanelBus DIGITAL TRANSMITTER
SLLS611 AUGUST 2004
25
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TI 64-pin TQFP PowerPAD package
The TFP513 is available in TI’s thermally enhanced 64-pin TQFP PowerPAD package. The PowerPAD package
is a 10-mm
× 10-mm × 1,0-mm TQFP outline with 0,5-mm lead-pitch. The PowerPAD package has a specially
designed die mount pad that offers improved thermal capability over typical TQFP packages of the same outline.
The TI 64-pin TQFP PowerPAD package offers a backside solder plane that connects directly to the die mount
pad for enhanced thermal conduction. For thermal considerations, soldering the backside of the TFP513 to the
application board is not required because the device power dissipation is well within the package capability
when not soldered. If traces or vias are located under the backside pad, they must be protected by a suitable
solder mask or other assembly technique to prevent inadvertent shorting to the exposed backside pad.
Soldering the backside of the device to a thermal land connected to the PCB ground plane is recommended
for electrical and EMI considerations. The thermal land may be soldered to the exposed PowerPAD using
standard reflow soldering techniques.
The recommended pad size for the grounded thermal land is 5,5 mm minimum, centered in the device land
pattern. When vias are required to ground the land, multiple vias are recommended for a low impedance
connection to the ground plane. Vias in the exposed pad must be small enough or filled to prevent wicking the
solder away from the interface between the package body and the thermal land on the surface of the board
during solder reflow.
Thermal Vias
5,5 mm Square
Minimum
Figure 15. Thermal Vias
Table 2 contains the thermal properties of the TI 64-pin TQFP PowerPAD package. The 64-pin TQFP
non-PowerPAD package is included only for reference.
Table 2. TI 64-Pin TQFP (10
× 10 × 1,0 mm)/0,5 mm Lead-Pitch
PARAMETER
WITHOUT
PowerPAD
PowerPAD
NOT CONNECTED TO
PCB THERMAL PLANE
PowerPAD
CONNECTED TO PCB
THERMAL PLANE
(see Note 14)
RθJA
Thermal resistance, junction-to-ambient
(see Notes 13 and 14)
75.83
°C/W
42.20
°C/W
22.43
°C/W
RθJC Thermal resistance, junction-to-case (see Notes 13 and 14)
7.80
°/W
0.38
°C/W
0.38
°C/W
PD
Power handling capabilities of package (see Notes 13, 14,
and 15)
0.92 W
1.66 W
3.26 W
NOTES: 13. Specified with the bond pad on the backside of the PowerPAD package soldered to a 2-oz. Cu plate PCB thermal plane
14. Airflow is at 0 LFM (no airflow).
15. Specified at 150
°C junction temperature and 80°C ambient temperature
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