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參數(shù)資料
型號(hào): TMC3503R2C50T
廠商: FAIRCHILD SEMICONDUCTOR CORP
元件分類(lèi): DAC
英文描述: PARALLEL, 8 BITS INPUT LOADING, 0.015 us SETTLING TIME, 8-BIT DAC, PQCC44
封裝: PLASTIC, LCC-44
文件頁(yè)數(shù): 5/17頁(yè)
文件大小: 106K
代理商: TMC3503R2C50T
PRODUCT SPECIFICATION
TMC3503
REV. 1.02 11/24/99
13
Mechanical Dimensions – 48-pin LQFP Package
D
E1
E
e
PIN 1
IDENTIFIER
B
Base Plane
Seating Plane
See Lead Detail
C
0.063" Ref (1.60mm)
L
-C-
ccc
C
LEAD COPLANARITY
A2
A
A1
α
A
.055
.063
1.40
1.60
Symbol
Inches
Min.
Max.
Min.
Max.
Millimeters
Notes
A1
.001
.005
.05
.15
.057
1.45
A2
.053
1.35
B
.006
.010
.17
.27
D/E
D1/E1
.019 BSC
.346
.362
8.8
9.2
.268
.284
6.8
7.2
.50 BSC
e
L
.017
.029
.45
.75
6
4
5
2
7
8
α
0
°
7
°
0
°
7
°
N48
48
12
ND
ccc
.004
0.08
Notes:
1.
2.
3.
4.
5.
6.
7.
8.
D1
All dimensions and tolerances conform to ANSI Y14.5M-1982.
Dimensions "D1" and "E1" do not include mold protrusion.
Allowable protrusion is 0.25mm per side. D1 and E1 are maximum
plastic body size dimensions including mold mismatch.
Pin 1 identifier is optional.
Dimension ND: Number of terminals.
Dimension ND: Number of terminals per package edge.
"L" is the length of terminal for soldering to a substrate.
Dimension "B" does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed the
maximum B dimension by more than 0.08mm. Dambar can not be
located on the lower radius or the foot. Minimum space between
protrusion and an adjacent lead is 0.07mm for 0.4mm and 0.5mm
pitch packages.
To be determined at seating place —C—
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