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參數(shù)資料
| 型號： | TMP320C6211GJC167 |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | TRIMMER, 1K |
| 中文描述： | 定點(diǎn)數(shù)字信號處理器 |
| 文件頁數(shù)： | 82/83頁 |
| 文件大小： | 1176K |
| 代理商： | TMP320C6211GJC167 |
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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
BGA
BGA
BGA
BGA
BGA
BGA
BGA
Package
Drawing
GFN
GFN
GFN
GFN
GFN
GFN
GFN
Pins Package
Qty
40
40
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
TMS320C6211BGFN150
TMS320C6211BGFN167
TMS320C6211GFN150
TMS320C6211GFN167
TMS32C6211BGFNA150
TMX320C6211GFN
TMX320C6211GFN21
ACTIVE
ACTIVE
NRND
NRND
ACTIVE
OBSOLETE
OBSOLETE
256
256
256
256
256
256
256
None
None
None
None
None
None
None
SNPB
SNPB
Call TI
Call TI
SNPB
Call TI
Call TI
Level-4-220C-72HR
Level-4-220C-72HR
Call TI
Call TI
Level-4-220C-72HR
Call TI
Call TI
40
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
for the latest availability information and additionalproduct content details.
None:
Not yet available Lead (Pb-Free).
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
17-Dec-2004
Addendum-Page 1
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