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參數(shù)資料
| 型號(hào)： | TS2007IQT |
| 廠商： | STMICROELECTRONICS |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 2.3 W, 1 CHANNEL, AUDIO AMPLIFIER, DSO8 |
| 封裝： | 3 X 3 MM, DFN-8 |
| 文件頁(yè)數(shù)： | 19/29頁(yè) |
| 文件大小： | 464K |
| 代理商： | TS2007IQT |
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Package information
TS2007
26/29
5
Package information
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK packages. These packages have a lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
Figure 52.
Pinout (top view)
Figure 53.
Marking (top view)
Figure 54.
Recommended footprint for the TS2007 DFN8 package
1
2
3
4
8
7
6
5
1
2
3
4
8
7
6
5
Logo: ST
Part number: K007
Three digit date code: YWW
The dot is for marking pin 1
1.8 mm
0.8 mm
0.35 mm
0.65 mm
1.4 mm
2.2 mm
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