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參數(shù)資料
型號(hào)： TS83102G0BVGL
廠商： E2V TECHNOLOGIES PLC
元件分類： ADC
英文描述： 1-CH 10-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CBGA152
封裝： 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-152
文件頁(yè)數(shù)： 10/60頁(yè)
文件大小： 1510K
代理商： TS83102G0BVGL
18
0830E–BDC–06/07
TS83102G0B
e2v semiconductors SAS 2007
Figure 9-1.
Black Anodized Aluminium Heat Sink Glued on a Copper Base Screwed on Board (all dimensions in mm)
Note:
The cooling system efficiency can be monitored using the temperature sensing diodes, integrated in the device. Refer to
9.2
Thermal Dissipation by Conduction Only
When the external heat sink cannot be used, the relevant thermal resistance is the thermal resistance
from the junction to the bottom of the balls: RTH
J-Bottom-of-balls.
The thermal path, in this case, is the junction, then the silicon, glue, CuW heat spreader, package Al2O3,
and the balls (Sn63Pb37).
The Finite Element Method (FEM) with the thermal simulator leads to
RTH
J-bottom of balls = 12.3°C/W. This value assumes pure conduction from the junction to the bottom of the
balls (this is the worst case, no radiation and no convection is applied). With such an assumption, RTH
J-
Bottom-of-balls is user-independent.
To complete the thermal analysis, you must add the thermal resistance from the top of the board (on
which the device is soldered) to the ambient resistance, whose values are user-dependent (the type of
board, thermal, routing, area covered by copper in each board layer, thickness, airflow or cold plate are
all parameters to consider).
8.5
50
52
20
22
15
9
40
0.5
7.4
Circular Base
(diam. 8.5 mm)
CuW Heat Spreader
Tied to VEE = -5 V
AI203
Copper Base with
Standoffs
Board
Holes for Screw
(diam. 2 mm)
Black Anodized
Aluminium
相關(guān)PDF資料
PDF描述
TS83102G0BCGL 1-CH 10-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CBGA152
TS83110CZT 1-CH 10-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CDFP28
TS83110MZT 1-CH 10-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CDFP28
TS83110VZT 1-CH 10-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CDFP28
TS83110MZB/T 1-CH 10-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CDSO28
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TS83102G0CGL 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Analog to Digital Converter
TS83102G0GSZR5 制造商:e2v technologies 功能描述:TS83102G0GSZR5 - Trays
TS831-3I 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:MICROPOWER VOLTAGE SUPERVISOR RESET ACTIVE LOW
TS831-3ID 功能描述:監(jiān)控電路 2.71V Micropower AL RoHS:否 制造商:STMicroelectronics 監(jiān)測(cè)電壓數(shù): 監(jiān)測(cè)電壓: 欠電壓閾值: 過(guò)電壓閾值: 輸出類型:Active Low, Open Drain 人工復(fù)位:Resettable 監(jiān)視器:No Watchdog 電池備用開(kāi)關(guān):No Backup 上電復(fù)位延遲（典型值）:10 s 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:UDFN-6 封裝:Reel
TS831-3IDT 功能描述:監(jiān)控電路 2.71V Micropower AL RoHS:否 制造商:STMicroelectronics 監(jiān)測(cè)電壓數(shù): 監(jiān)測(cè)電壓: 欠電壓閾值: 過(guò)電壓閾值: 輸出類型:Active Low, Open Drain 人工復(fù)位:Resettable 監(jiān)視器:No Watchdog 電池備用開(kāi)關(guān):No Backup 上電復(fù)位延遲（典型值）:10 s 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:UDFN-6 封裝:Reel
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