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參數資料
| 型號： | TS8388BMFSB/Q |
| 廠商： | E2V TECHNOLOGIES PLC |
| 元件分類： | ADC |
| 英文描述： | 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQFP68 |
| 封裝： | CERAMIC, QFP-68 |
| 文件頁數： | 40/62頁 |
| 文件大小： | 1267K |
| 代理商： | TS8388BMFSB/Q |
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45
0860E–BDC–05/07
e2v semiconductors SAS 2007
TS8388B
10.2.2
Thermal Resistance from Junction to Case: RTHJC
Typical value for Rthjc is given to 6.7°C/W (8°C/W max).
This value does not include thermal contact resistance between package and external component (heat-
sink or PCBoard).
As an example, 2.0
°C/W can be taken for 50 m of thermal grease.
10.2.3
CBGA68 Board Assembly with External Heatsink
It is recommended to use an external heatsink or PCBoard special design.
Cooling system efficiency can be monitored using the Temperature Sensing Diode, integrated in the
device.
Figure 10-2. CBGA68 Board Assembly
10.2.4
Moisture Characteristics
This device is sensitive to the moisture (MSL3 according to JEDEC standard):
Shelf life in sealed bag: 12 months at <40
°C and <90% relative humidity (RH).
After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equiva-
lent processing (peak package body temperature 220
°C) must be:
Mounted within 198 hours at factory conditions of
≤30°C/60% RH, or
Stored at
≤20% RH.
Devices require baking, before mounting, if Humidity Indicator Card is >20% when read at 23
°C ±5°C.
If baking is required, devices may be baked for:
192 hours at 40
°C +5°C/–0°C and <5% RH for low-temperature device containers, or
24 hours at 125
°C ±5°C for high temperature device containers.
31
32.5
Board
50.5
20.2
24.2
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| TS8388BVF | 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQFP68 |
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相關代理商/技術參數 |
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