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| 型號(hào)： | TS8388BMFSB/T |
| 廠商： | E2V TECHNOLOGIES PLC |
| 元件分類(lèi)： | ADC |
| 英文描述： | 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQFP68 |
| 封裝： | CERAMIC, QFP-68 |
| 文件頁(yè)數(shù)： | 41/62頁(yè) |
| 文件大小： | 1267K |
| 代理商： | TS8388BMFSB/T |
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46
0860E–BDC–05/07
TS8388B
e2v semiconductors SAS 2007
10.3
Nominal CQFP68 Thermal Characteristics
Although the power dissipation is low for this performance, the use of a heat sink is mandatory.
The user will find some advice on this topics below.
10.3.1
Thermal Resistance from Junction to Ambient: RTHJA
The following table lists the converter thermal performance parameters, with or without heatsink.
For the following measurements, a 50 x 50 x 16 mm heatsink has been used (see Figure 10-4 on page
47).
Note:
1. Heatsink is glued to backside of package or screwed and pressed with thermal grease.
Figure 10-3. Thermal Resistance from Junction to Ambient: RTHJA
Table 10-2.
Thermal Resistance
Air Flow
(m/s)
Estimated JA Thermal Resistance (
°C/W)
CQFP68 on Board
Estimated – without Heatsink
Targeted – with Heatsink(1)
050
10
0.5
40
8.9
135
7.9
1.5
32
7.3
230
6.8
2.5
28
6.5
326
6.2
424
5.8
523.5
5.6
RTHJA
(
°C/W)
Air Flow (m/s)
0
10
20
30
40
50
60
12
3
4
5
Without heatsink
With heatsink
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