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參數資料
| 型號： | TS8388BMFSB/T |
| 廠商： | E2V TECHNOLOGIES PLC |
| 元件分類： | ADC |
| 英文描述： | 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQFP68 |
| 封裝： | CERAMIC, QFP-68 |
| 文件頁數： | 43/62頁 |
| 文件大小： | 1267K |
| 代理商： | TS8388BMFSB/T |
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48
0860E–BDC–05/07
TS8388B
e2v semiconductors SAS 2007
10.4
Enhanced CQFP68 Thermal Characteristics
10.4.1
Enhanced CQFP68
The CQFP68 has been modified, in order to improve the thermal characteristics:
A CuW heatspreader has been added at the bottom of the package.
The die has been electrically isolated with the ALN substrate.
10.4.2
Thermal Resistance from Junction to Case: RTHJC
Typical value for Rthjc is given to 1.56
°C/W.
This value does not include thermal contact resistance between package and external component (heat-
sink or PCBoard).
As an example, 2.0
°C/W can be taken for 50 m of thermal grease.
10.4.3
Heatsink
It is recommended to use an external heatsink, or PCBoard special design.
The stand off has been calculated to permit the simultaneous soldering of the leads and of the
heatspreader with the solder paste.
Figure 10-5. Enhanced CQFP68 Suggested Assembly
Cooling system efficiency can be monitored using the Temperature Sensing Diode, integrated in the
device.
Printed
circuit board
CuW heatspreader
28.78
Thermal via
Solid ground plane
24.13
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| TS8388BVFS | 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQFP68 |
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