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參數(shù)資料
型號(hào)： UBA2051A
廠商： NXP Semiconductors N.V.
英文描述： One-chip telephone ICs with speech, dialler and ringer functions
中文描述： 一個(gè)有語(yǔ)言，撥號(hào)及振鈴電話集成電路芯片的功能
文件頁(yè)數(shù)： 49/52頁(yè)
文件大小： 292K
代理商： UBA2051A
2000 May 19
49
Philips Semiconductors
Product specification
One-chip telephone ICs with speech,
dialler and ringer functions
UBA2050(A); UBA2051(A;C)
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
相關(guān)PDF資料
PDF描述
UBA2051AT One-chip telephone ICs with speech, dialler and ringer functions
UBA2051C One-chip telephone ICs with speech, dialler and ringer functions
UBA2051CT One-chip telephone ICs with speech, dialler and ringer functions
UBA2051T One-chip telephone ICs with speech, dialler and ringer functions
UBA2070 8-bit MCU for automotive with 16 to 60 Kbyte Flash, ADC, CSS, 5 timers, SPI, SCI, I2C interface
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
UBA2051AT 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:One-chip telephone ICs with speech, dialler and ringer functions
UBA2051C 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:One-chip telephone ICs with speech, dialler and ringer functions
UBA2051CT 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:One-chip telephone ICs with speech, dialler and ringer functions
UBA2051T 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:One-chip telephone ICs with speech, dialler and ringer functions
UBA2070 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:600 V CCFL ballast driver IC
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