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參數資料
型號: UBA2051C
廠商: NXP Semiconductors N.V.
英文描述: One-chip telephone ICs with speech, dialler and ringer functions
中文描述: 一個有語言,撥號及振鈴電話集成電路芯片的功能
文件頁數: 31/52頁
文件大小: 292K
代理商: UBA2051C
2000 May 19
31
Philips Semiconductors
Product specification
One-chip telephone ICs with speech,
dialler and ringer functions
UBA2050(A); UBA2051(A;C)
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Notes
1.
2.
Calculated for T
amb
= 75
°
C and T
j
= 125
°
C.
Mostly dependent on the maximum required ambient temperature and on the voltage between pins LN and SLPE
(see Fig.31).
THERMAL CHARACTERISTICS
Note
1.
Mounted on glass epoxy board 28.5
×
19.1
×
1.5 mm.
SYMBOL
PARAMETER
CONDITIONS
R
SLPE
= 20
;
note 1
MIN.
MAX.
UNIT
P
tot
total power dissipation
625
mW
T
amb
T
stg
T
j
Speech/transmission part
ambient temperature
storage temperature
junction temperature
25
40
+75
+125
125
°
C
°
C
°
C
V
LN
V
LN(R)
positive continuous voltage on pin LN
repetitive voltage on pin LN during switch-on
or line interruption
line current
GND
0.4
GND
0.4
12
13.2
V
V
I
LN
R
SLPE
= 20
;
note 2
140
mA
V
CC
supply voltage for the speech/transmission
part and peripherals
stabilized supply voltage for the dialler and
ringer parts
input current at pin V
DD
for the dialler and
ringer parts
voltage on pins SLPE, IR, REG, AGC, DTMF,
RX, QR, GAR, MIC+ and MIC
GND
0.4
12
V
V
DD
I
DD
75 mA
GND
0.4
3.6
V
I
DD
I
line
= 0 mA
75
mA
V
n
GND
0.4
V
CC
+ 0.4
V
Dialler and ringer parts
V
n
I
n
voltage on pins 8 to 21
DC sink/source current for pins 8 to 21
GND
0.4
10
V
DD
+ 0.4
+10
V
mA
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th(j-a)
thermal resistance from junction to ambient
in free air; note 1
70
K/W
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