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參數(shù)資料
| 型號(hào)： | W25P022AD-6 |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | SRAM |
| 英文描述： | 64K X 32 BURST PIPELINED HIGH-SPEED CMOS STATIC RAM |
| 中文描述： | 64K X 32 STANDARD SRAM, 6 ns, PQFP100 |
| 封裝： | MO-136, TQFP-100 |
| 文件頁數(shù)： | 16/17頁 |
| 文件大?。?/td> | 310K |
| 代理商： | W25P022AD-6 |
W25P022A
- 16 -
PACKAGE DIMENSIONS
100-pin QFP
E H
E
y
A
A
Seating Plane
L
L
1
See Detail F
1. Dimensions D & E do not include interlead flash.
2. Dimension b does not include dambar
3. Controlling dimension: Millimeters
4. General appearance spec. should be based
0.08
0
7
0
0.003
1.60
0.95
17.40
0.80
17.20
0.65
17.00
0.063
0.037
0.921
0.685
0.031
0.913
0.677
0.025
0.905
0.669
0.65
20.10
14.10
0.20
0.40
2.87
20.00
14.00
2.72
19.90
13.90
0.10
0.20
2.57
0.791
0.555
0.008
0.016
0.113
0.787
0.551
0.107
0.026
0.783
0.547
0.004
0.008
0.101
Notes:
Symbol
Min. Nom. Max.
Max.
Nom.
Min.
Dimension in inches
Dimension in mm
A
A
A
b
c
D
E
e
H
D
H
E
L
L
1
y
1
2
0.012
0.006
0.15
0.30
23.00
23.20
23.40
7
0.020
0.032
0.498
0.802
0.35
0.25
0.01
0.014
0.018
0.45
H
D
D
b
e
2
1
C
100-pin TQFP
E H
E
y
A
A
Seating Plane
L
L
1
See Detail F
1. Dimensions D & E do not include interlead flash.
2. Dimension b does not include dambar
3. Controlling dimension: Millimeters
4. General appearance spec. should be based
0.08
0
7
0
0.003
1.00
0.75
16.10
0.60
16.00
0.45
15.90
0.039
0.030
0.870
0.634
0.024
0.866
0.630
0.018
0.862
0.626
0.65
20.10
14.10
0.20
0.38
1.45
20.00
14.00
1.40
19.90
13.90
0.10
0.22
1035
0.791
0.555
0.008
0.015
0.057
0.787
0.551
0.055
0.026
0.783
0.547
0.004
0.009
0.053
Notes:
Symbol
Min. Nom. Max.
Max.
Nom.
Min.
Dimension in inches
Dimension in mm
A
A
A
b
c
D
E
e
H
D
H
E
L
L
1
y
1
2
0.013
0.006
0.15
0.32
21.90
22.00
22.10
7
0.020
0.032
0.498
0.802
0.10
0.05
0.002 0.004
0.006
0.15
H
D
D
2
1
b
e
C
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相關(guān)代理商/技術(shù)參數(shù) |
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| W25P022AD-7 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:64K X 32 BURST PIPELINED HIGH-SPEED CMOS STATIC RAM |
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