參數資料
| 型號： | 7038BG |
| 廠商： | Aavid Thermalloy |
| 文件頁數： | 13/116頁 |
| 文件大小： | 0K |
| 描述： | BOARD LEVEL HEAT SINK |
| 產品培訓模塊： | How to Select a Heat Sink |
| 標準包裝： | 2,000 |
| 類型： | 插件板級 |
| 冷卻式包裝： | Multiwatt，SIP |
| 固定方法： | 夾 |
| 形狀： | 矩形 |
| 長度： | 0.620"（15.75mm） |
| 寬： | 0.915"（23.24mm） |
| 機座外的高度（散熱片高度）： | 0.380"（9.65mm） |
| 溫升時的功耗： | 1.5W @ 40°C |
| 在強制氣流下的熱敏電阻： | 在 600 LFM 時為6°C/W |
| 自然環境下的熱電阻： | 16°C/W |
| 材質： | 鋁 |
| 材料表面處理： | 黑色陽極化處理 |
| 其它名稱： | 032976 |
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11
READING
A
T
HERMAL
PERFORMANCE
GR
APH
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
The performance graphs you will see in this
catalog (see graph 579802) are actually a
composite of two separate graphs which
have been combined to save space. The small
arrows on each curve indicate to which axis
the curve corresponds. Thermal graphs are
published assuming the device to be cooled
is properly mounted and the heat sink is in
its recommended mounting position.
GRAPH A is used to show heat sink perform-
ance when used in a natural convection envi-
ronment (i.e. without forced air). This graph
starts in the lower left hand corner with the
horizontal axis representing the heat dissipa-
tion (watts) and the vertical left hand axis
representing the rise in heat sink mounting
surface temperature above ambient (°C). By
knowing the power to be dissipated, the
temperature rise of the mounting surface
can be predicted. Thermal resistance in natu-
ral convection is determined by dividing this
temperature rise by the power input (°C/W).
EXAMPLE A: Aavid Thermalloy part number
579802 is to be used to dissipate 3 watts of
power in natural convection. Because we are
dealing with natural convection, we refer to
graph “A”. Knowing that 3 watts are to be dis-
sipated, follow the grid line to the curve and
find that at 3 watts there is a temperature
rise of 75°C. To get the thermal resistance,
divide the temperature rise by the power
dissipated, which yields 25°C/W.
GRAPH B is used to show heat sink per-
formance when used in a forced convec-
tion environment (i.e. with forced air flow
through the heat sink). This graph has its
origin in the top right hand corner with
the horizontal axis representing air velocity
over the heat sink LFM* and the vertical
axis representing the thermal resistance of
the heat sink (°C/W). Air velocity is calculat-
ed by dividing the output volumetric flow
rate of the fan by the cross-sectional area
of the outflow air passage.
EXAMPLE B: For the same application
we add a fan which blows air over the heat
sink at a velocity of 400 LFM.
The addition of a fan indicates the use of
forced convection and therefore we refer
to graph “B”. This resistance of 9.50°C/W is
then multiplied by the power to be dissi-
pated, 3 watts. This yields a temperature
rise of 28.5°C.
CONVERTING VOLUME
TO VELOCITY
Although most fans are normally rated and
compared at their free air delivery at zero
back pressure, this is rarely the case in most
applications. For accuracy, the volume of
output must be derated 60%–80% for
the anticipation of back pressure.
EXAMPLE: The output air volume
of a fan is given as 80 CFM. The output area
is 6 inches by 6 inches or 36 in2 or 25 ft2.
To find velocity:
80
0.25
Velocity is 320 LFM, which at 80%,
derates to 256 LFM.
DESIGN ASSISTANCE
Aavid Thermalloy can assist in the design
of heat sinks for both forced and natural
convection applications. Contact us for help
with your next thermal challenge. For more
information, visit our web site at:
www.aavidthermalloy.com
Heat Dissipated—Watts
0
20
40
60
80
100
01
2
3
4
5
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Air Velocity—Feet Per Minute
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
20
16
12
4
8
0
400
200
600
800
1000
GRAPH B
Velocity (LFM) =
Velocity =
= 320
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
20
0
20
40
60
80
100
01
2
3
4
5
16
12
4
8
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
GRAPH A
579802
Reading a Thermal Performance Graph
Velocity
(LFM)* = Volume (CFM)**
area (ft2)
* Linear feet per minute
** Cubic feet per minute
Volume (CFM)
area (ft2)
相關PDF資料 |
PDF描述 |
|---|---|
| 5767032-3 | CONN PLUG 114POS VERT .025 SMD |
| 5767017-3 | CONN PLUG 114POS VERT .025 SMD |
| 767057-4 | CONN PLUG 152POS VERT .025 SMD |
| SOMC160310K0JEA | RES ARRAY 10K OHM 8 RES 16-SOIC |
| 767087-4 | CONN PLUG 152POS VERT .025 SMD |
相關代理商/技術參數 |
參數描述 |
|---|---|
| 7038L15PF | 功能描述:靜態隨機存取存儲器 RoHS:否 制造商:IDT 存儲容量: 組織: 訪問時間: 電源電壓-最大: 電源電壓-最小: 最大工作電流: 最大工作溫度: 最小工作溫度: 安裝風格: 封裝 / 箱體: 封裝: |
| 7038L15PF8 | 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 1.125M-Bit 64K x 18 15ns 100-Pin TQFP T/R 制造商:Integrated Device Technology Inc 功能描述:SRAM ASYNC DUAL 5V 1.125MBIT 64KX18 15NS 100TQFP - Tape and Reel |
| 7038L15PFG | 功能描述:靜態隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
| 7038L15PFG8 | 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 1.125M-Bit 64K x 18 15ns 100-Pin TQFP T/R 制造商:Integrated Device Technology Inc 功能描述:100 TQFP (PN100) - Tape and Reel |
| 7038L20PF | 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 1.125M-Bit 64K x 18 20ns 100-Pin TQFP 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 1.125M-Bit 64K x 18 20ns 100-Pin TQFP Tray 制造商:Integrated Device Technology Inc 功能描述:SRAM ASYNC DUAL 5V 1.125MBIT 64KX18 20NS 100TQFP - Rail/Tube |
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