參數資料
| 型號： | 7038BG |
| 廠商： | Aavid Thermalloy |
| 文件頁數： | 93/116頁 |
| 文件大小： | 0K |
| 描述： | BOARD LEVEL HEAT SINK |
| 產品培訓模塊： | How to Select a Heat Sink |
| 標準包裝： | 2,000 |
| 類型： | 插件板級 |
| 冷卻式包裝： | Multiwatt，SIP |
| 固定方法： | 夾 |
| 形狀： | 矩形 |
| 長度： | 0.620"（15.75mm） |
| 寬： | 0.915"（23.24mm） |
| 機座外的高度（散熱片高度）： | 0.380"（9.65mm） |
| 溫升時的功耗： | 1.5W @ 40°C |
| 在強制氣流下的熱敏電阻： | 在 600 LFM 時為6°C/W |
| 自然環境下的熱電阻： | 16°C/W |
| 材質： | 鋁 |
| 材料表面處理： | 黑色陽極化處理 |
| 其它名稱： | 032976 |
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OPTIONS
&
A
C
ESSORIES
C
O
NTENT
S
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886 (2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Thermal solutions go beyond the heat dissipator itself.
Aavid Thermalloy offers a total solution package,
which includes a number of options and accessory
items described in this section of the catalog.
A total thermal solution includes an efficient thermal
interface and means of mechanical attachment. Aavid
Thermalloy has a full-line of interface materials that
can be pre-applied or supplied as an accessory item.
Mechanical assembly options include attachment of
semiconductors to heat sinks, heat sinks to printed
circuit boards, and heat sinks to sockets of CPUs.
Aavid Thermalloy offers the most complete line
of value added options of any supplier in the industry.
Our full line of accessories includes mounting kits,
shoulder washers, insulators, mounting pads,
and various grease products and epoxies, which
are sold separately, and can be used with a variety
of Aavid heat sinks.
This section will provide the most complete solution
to your thermal requirement.
CONTENTS
How to decipher or construct an Aavid 12 digit part number.......................
How to decipher or construct a "Thermalloy" origin part number...............
Indexes.................................................................................................................................
Interface Materials
Pads
In-Sil-8TM Pads....................................................................................................................
Kon-DuxTM/Grafoil Pads..............................................................................................
Hi-Flow Pads...................................................................................................................
Alignment Pads................................................................................................................
Double Sided Tape Options (factory applied)
T414......................................................................................................................................
T405R....................................................................................................................................
T412......................................................................................................................................
T411......................................................................................................................................
T410R....................................................................................................................................
Labor Saving Heat Sink to Board and Device to Heat Sink Mounts
Wave-OnTM Mounts..........................................................................................................
Semiconductor Mounts.................................................................................................
Shur-LockTM Tabs...............................................................................................................
Solderable Staked on Tabs...........................................................................................
Solderable Mounting Tabs............................................................................................
Solderable Pins.................................................................................................................
Solderable Nuts.................................................................................................................
Clinch Nuts..........................................................................................................................
Solderable Studs...............................................................................................................
Device Mounting Studs..................................................................................................
Clips
Aavid Kool-KlipsTM............................................................................................................
Thermal Clips.....................................................................................................................
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相關代理商/技術參數 |
參數描述 |
|---|---|
| 7038L15PF | 功能描述:靜態隨機存取存儲器 RoHS:否 制造商:IDT 存儲容量: 組織: 訪問時間: 電源電壓-最大: 電源電壓-最小: 最大工作電流: 最大工作溫度: 最小工作溫度: 安裝風格: 封裝 / 箱體: 封裝: |
| 7038L15PF8 | 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 1.125M-Bit 64K x 18 15ns 100-Pin TQFP T/R 制造商:Integrated Device Technology Inc 功能描述:SRAM ASYNC DUAL 5V 1.125MBIT 64KX18 15NS 100TQFP - Tape and Reel |
| 7038L15PFG | 功能描述:靜態隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
| 7038L15PFG8 | 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 1.125M-Bit 64K x 18 15ns 100-Pin TQFP T/R 制造商:Integrated Device Technology Inc 功能描述:100 TQFP (PN100) - Tape and Reel |
| 7038L20PF | 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 1.125M-Bit 64K x 18 20ns 100-Pin TQFP 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 1.125M-Bit 64K x 18 20ns 100-Pin TQFP Tray 制造商:Integrated Device Technology Inc 功能描述:SRAM ASYNC DUAL 5V 1.125MBIT 64KX18 20NS 100TQFP - Rail/Tube |
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