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參數(shù)資料
型號： 7038BG
廠商： Aavid Thermalloy
文件頁數(shù)： 69/116頁
文件大小： 0K
描述： BOARD LEVEL HEAT SINK
產(chǎn)品培訓模塊： How to Select a Heat Sink
標準包裝： 2,000
類型： 插件板級
冷卻式包裝： Multiwatt，SIP
固定方法： 夾
形狀： 矩形
長度： 0.620"（15.75mm）
寬： 0.915"（23.24mm）
機座外的高度（散熱片高度）： 0.380"（9.65mm）
溫升時的功耗： 1.5W @ 40°C
在強制氣流下的熱敏電阻： 在 600 LFM 時為6°C/W
自然環(huán)境下的熱電阻： 16°C/W
材質(zhì)： 鋁
材料表面處理： 黑色陽極化處理
其它名稱： 032976
56
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
5297, 5298, 5299, 5300
Extruded heat sink with large radial fins
Extruded heat sink with large radial
fins features equal channel widths on
both sides for single or dual device
mounting. Includes two solderable
mounting pins which permit vertical
mounting and eliminate stress on
device leads. Available in four heights
for TO-220, TO-218, and TO-247 devices.
3.18
(0.125)
14.22
(0.560)
13.72
(0.540)
25.40
(1.000)
"C"
"A"
"B"
20.96
(0.825)
41.91
(1.650)
17.02
(0.670)
1.57
(0.062)
3.96
(0.156)
25.40
(1.000)
2.36
(0.093)
2x
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
5
0
20
40
60
80
100
0
4
8
12
16
20
4
3
1
2
0
400
200
600
800
1000
52980X
52970X
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Device
“A” Dim
“B” Dim
“C” Dim
529701B02500G
TO-218, TO-247
25.40 (1.000)
21.59 (0.850)
3.66 (0.144)
2.67 (0.105)
529702B02500G
TO-220
25.40 (1.000)
18.29 (0.720)
3.17 (0.125)
2.67 (0.105)
529801B02500G
TO-218, TO-247
38.10 (1.500)
21.59 (0.850)
3.66 (0.144)
2.67 (0.105)
529802B02500G
TO-220
38.10 (1.500)
18.29 (0.720)
3.17 (0.125)
2.67 (0.105)
529901B02500G
TO-218, TO-247
50.80 (2.000)
21.59 (0.850)
3.66 (0.144)
2.67 (0.105)
529902B02500G
TO-220
50.80 (2.000)
18.29 (0.720)
3.17 (0.125)
2.67 (0.105)
530001B02500G
TO-218, TO-247
63.50 (2.500)
21.59 (0.850)
3.66 (0.144)
2.67 (0.105)
530002B02500G
TO-220
63.50 (2.500)
18.29 (0.720)
3.17 (0.125)
2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
5
0
20
40
60
80
100
0
4
8
12
16
20
4
3
1
2
0
400
200
600
800
1000
53000X
52990X
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
For additional options see page 83
TO-220 & TO-218 & TO-247 Heat Sinks
SW25, SW38, SW50, SW63
Extruded heat sink with unequal channel widths
Extruded heat sink with unequal
channel widths front and back
can accommodate a TO-220, TO-218,
or TO-247 devices. Includes two solder-
able mounting pins which permit verti-
cal mounting and eliminate stress on
device leads. Available in three heights.
Version without hole uses clip 5901
(sold separately) to attach device.
See page 97 for clip information.
25.00
(0.984) 19.90
(0.783)
15.00
(0.591)
4.00
(0.157)
2.50
(0.098)
25.40
(1.000)
3.20
(0.126)
"A"
SEE NOTE 1
TYP
34.50
(1.358)
12.50
(0.492)
6.25
(0.246)
2.00
(0.079)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
10
0
20
40
60
80
100
02
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
SW38
SW25
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°
C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Description
“A” Dim
Holes
SW25-2G
Extruded heat sink with unequal channel widths front and back
25.00 (0.984)
No
3.00 (0.118)
SW25-4G
With device mounting holes
25.00 (0.984)
Yes
3.00 (0.118)
SW38-2G
Extruded heat sink with unequal channel widths front and back
38.00 (1.496)
No
3.00 (0.118)
SW38-4G
With device mounting holes
38.00 (1.496)
Yes
3.00 (0.118)
SW50-2G
Extruded heat sink with unequal channel widths front and back
50.00 (1.968)
No
3.00 (0.118)
SW50-4G
With device mounting holes
50.00 (1.968)
Yes
3.00 (0.118)
SW63-2G
Extruded heat sink with unequal channel widths front and back
63.00 (2.480)
No
3.00 (0.118)
SW63-4G
With device mounting holes
63.00 (2.480)
Yes
3.00 (0.118)
Dia of PCB
Plated Thru
Hole for Pins
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
10
0
20
40
60
80
100
02
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
SW63
SW50
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°
C
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
NOTE 1: This hole not present in SW25 model
相關PDF資料
PDF描述
5767032-3 CONN PLUG 114POS VERT .025 SMD
5767017-3 CONN PLUG 114POS VERT .025 SMD
767057-4 CONN PLUG 152POS VERT .025 SMD
SOMC160310K0JEA RES ARRAY 10K OHM 8 RES 16-SOIC
767087-4 CONN PLUG 152POS VERT .025 SMD
相關代理商/技術參數(shù)
參數(shù)描述
7038L15PF 功能描述:靜態(tài)隨機存取存儲器 RoHS:否 制造商:IDT 存儲容量: 組織: 訪問時間: 電源電壓-最大: 電源電壓-最小: 最大工作電流: 最大工作溫度: 最小工作溫度: 安裝風格: 封裝 / 箱體: 封裝:
7038L15PF8 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 1.125M-Bit 64K x 18 15ns 100-Pin TQFP T/R 制造商:Integrated Device Technology Inc 功能描述:SRAM ASYNC DUAL 5V 1.125MBIT 64KX18 15NS 100TQFP - Tape and Reel
7038L15PFG 功能描述:靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
7038L15PFG8 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 1.125M-Bit 64K x 18 15ns 100-Pin TQFP T/R 制造商:Integrated Device Technology Inc 功能描述:100 TQFP (PN100) - Tape and Reel
7038L20PF 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 1.125M-Bit 64K x 18 20ns 100-Pin TQFP 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 1.125M-Bit 64K x 18 20ns 100-Pin TQFP Tray 制造商:Integrated Device Technology Inc 功能描述:SRAM ASYNC DUAL 5V 1.125MBIT 64KX18 20NS 100TQFP - Rail/Tube
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