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參數資料
| 型號： | AD8137YRZ-REEL7 |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 運動控制電子 |
| 英文描述： | Low Cost, Low Power 12-Bit Differential ADC Driver |
| 中文描述： | OP-AMP, 2600 uV OFFSET-MAX, PDSO8 |
| 封裝： | ROHS COMPLIANT, MS-012AA, SOIC-8 |
| 文件頁數： | 24/24頁 |
| 文件大小： | 594K |
| 代理商： | AD8137YRZ-REEL7 |
AD8137
OUTLINE DIMENSIONS
Rev. A | Page 24 of 24
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
0.50 (0.0196)
0.25 (0.0099)
×
45°
8°
0°
1.75 (0.0688)
1.35 (0.0532)
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0040)
4
1
8
5
5.00(0.1968)
4.80(0.1890)
4.00 (0.1574)
3.80 (0.1497)
1.27 (0.0500)
BSC
6.20 (0.2440)
5.80 (0.2284)
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-012AA
Figure 70. 8-Lead Standard Small Outline Package [SOIC]
Narrow Body (R-8)—Dimensions shown in millimeters (inches)
1
EXPOSED
(BOTTOM VIEW)
0.50
BSC
0.60 MAX
PIN 1
INDICATOR
1.50
REF
0.50
0.40
0.30
0.25
MIN
0.45
2.75
BSC SQ
TOP
VIEW
12° MAX
0.80 MAX
0.65TYP
SEATING
PLANE
INDICPIN 1
0.90
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
1.90
1.75
1.60
4
1.60
1.45
1.30
3.00
BSC SQ
5
8
Figure 71. 8-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body (CP-8-2)—Dimensions shown in millimeters
ORDERING GUIDE
Model
AD8137YR
AD8137YR-REEL
AD8137YR-REEL7
AD8137YRZ
1
AD8137YRZ-REEL
1
AD8137YRZ-REEL7
1
AD8137YCP-R2
AD8137YCP-REEL
AD8137YCP-REEL7
AD8137YCPZ-R2
1
AD8137YCPZ-REEL
1
AD8137YCPZ-REEL7
1
Temperature Range
40°C to +125°C
40°C to +125°C
40°C to +125°C
40°C to +125°C
40°C to +125°C
40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
Package Description
8-Lead Standard Small Outline Package (SOIC)
8-Lead Standard Small Outline Package (SOIC)
8-Lead Standard Small Outline Package (SOIC)
8-Lead Standard Small Outline Package (SOIC)
8-Lead Standard Small Outline Package (SOIC)
8-Lead Standard Small Outline Package (SOIC)
8-Lead Lead Frame Chip Scale Package (LFCSP)
8-Lead Lead Frame Chip Scale Package (LFCSP)
8-Lead Lead Frame Chip Scale Package (LFCSP)
8-Lead Lead Frame Chip Scale Package (LFCSP)
8-Lead Lead Frame Chip Scale Package (LFCSP)
8-Lead Lead Frame Chip Scale Package (LFCSP)
Package Option
R-8
R-8
R-8
R-8
R-8
R-8
CP-8-2
CP-8-2
CP-8-2
CP-8-2
CP-8-2
CP-8-2
Branding
HFB
HFB
HFB
HGB
HGB
HGB
1
Z = Pb-free part.
2004 Analog Devices, Inc. All rights reserved. Trademarks and
regis-
tered trademarks are the property of their respective owners.
D04771–0–8/04(A)
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