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參數資料
| 型號： | AD9211_07 |
| 廠商： | Analog Devices, Inc. |
| 英文描述： | 10-Bit, 200 MSPS/250 MSPS/300 MSPS, 1.8 V Analog-to-Digital Converter |
| 中文描述： | 10位，200 MSPS/250 MSPS/300 MSPS的，1.8 V模擬到數字轉換器 |
| 文件頁數： | 8/28頁 |
| 文件大?。?/td> | 1180K |
| 代理商： | AD9211_07 |
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AD9211
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
ELECTRICAL
AVDD to AGND
DRVDD to DRGND
AGND to DRGND
AVDD to DRVDD
D0+/D0 through D9+/D9
to DRGND
DCO to DRGND
OR to DGND
CLK+ to AGND
CLK to AGND
VIN+ to AGND
VIN to AGND
SDIO/DCS to DGND
PWDN to AGND
CSB to AGND
SCLK/DFS to AGND
ENVIRONMENTAL
Storage Temperature Range
Operating Temperature Range
Lead Temperature
(Soldering 10 sec)
Junction Temperature
Rev. 0 | Page 8 of 28
Rating
0.3 V to +2.0 V
0.3 V to +2.0 V
0.3 V to +0.3 V
2.0 V to +2.0 V
0.3 V to DRVDD + 0.3 V
0.3 V to DRVDD + 0.3 V
0.3 V to DRVDD + 0.3 V
0.3 V to +3.9 V
0.3 V to +3.9 V
0.3 V to AVDD + 0.2 V
0.3 V to AVDD + 0.2 V
0.3 V to DRVDD + 0.3 V
0.3 V to +3.9 V
0.3 V to +3.9 V
0.3 V to +3.9 V
65°C to +125°C
40°C to +85°C
300°C
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane
for the LFCSP package. Soldering the exposed paddle to the
customer board increases the reliability of the solder joints,
maximizing the thermal capability of the package.
Table 6.
Package Type
56-Lead LFCSP (CP-56-2)
θ
JA
30.4
θ
JC
2.9
Unit
°C/W
Typical θ
JA
and θ
JC
are specified for a 4-layer board in still air.
Airflow increases heat dissipation, effectively reducing θ
JA
. In
addition, metal in direct contact with the package leads from
metal traces, and through holes, ground, and power planes
reduces the θ
JA
.
ESD CAUTION
相關PDF資料 |
PDF描述 |
|---|---|
| AD9211-200EBZ | 10-Bit, 200 MSPS/250 MSPS/300 MSPS, 1.8 V Analog-to-Digital Converter |
| AD9211-250EBZ | 10-Bit, 200 MSPS/250 MSPS/300 MSPS, 1.8 V Analog-to-Digital Converter |
| AD9211-300EBZ | 10-Bit, 200 MSPS/250 MSPS/300 MSPS, 1.8 V Analog-to-Digital Converter |
| AD9211BCPZ-300 | 10-Bit, 200 MSPS/250 MSPS/300 MSPS, 1.8 V Analog-to-Digital Converter |
| AD9211 | 10-Bit, 170/200/250 MSPS 1.8 V A/D Converter |
相關代理商/技術參數 |
參數描述 |
|---|---|
| AD9211-170EB | 制造商:AD 制造商全稱:Analog Devices 功能描述:10-Bit, 170/200/250 MSPS 1.8 V A/D Converter |
| AD9211-200EB | 制造商:AD 制造商全稱:Analog Devices 功能描述:10-Bit, 170/200/250 MSPS 1.8 V A/D Converter |
| AD9211-200EBZ | 功能描述:BOARD EVAL FOR AD9211-200 RoHS:是 類別:編程器，開發系統 >> 評估板 - 模數轉換器 (ADC) 系列:- 產品培訓模塊:Obsolescence Mitigation Program 標準包裝:1 系列:- ADC 的數量:1 位數:12 采樣率（每秒）:94.4k 數據接口:USB 輸入范圍:±VREF/2 在以下條件下的電源（標準）:- 工作溫度:-40°C ~ 85°C 已用 IC / 零件:MAX11645 已供物品:板，軟件 |
| AD9211-250EB | 制造商:AD 制造商全稱:Analog Devices 功能描述:10-Bit, 170/200/250 MSPS 1.8 V A/D Converter |
| AD9211-250EBZ | 功能描述:數據轉換 IC 開發工具 10-Bit 250 Msps ADC RoHS:否 制造商:Texas Instruments 產品:Demonstration Kits 類型:ADC 工具用于評估:ADS130E08 接口類型:SPI 工作電源電壓:- 6 V to + 6 V |
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