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參數資料
| 型號： | AD9444 |
| 廠商： | Analog Devices, Inc. |
| 英文描述： | 14-Bit, 80 MSPS, A/D Converter |
| 中文描述： | 14位，80 MSPS的，A / D轉換 |
| 文件頁數： | 8/40頁 |
| 文件大小： | 1291K |
| 代理商： | AD9444 |
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AD9444
ABSOLUTE MAXIMUM RATINGS
Table 5.
With
Respect to
ELECTRICAL
AVDD1
AGND
AVDD2
AGND
DRVDD
DGND
AGND
DGND
AVDD1
DRVDD
AVDD2
DRVDD
AVDD2
AVDD1
D0 to D13
DGND
CLK, MODE
AGND
VIN+, VIN
AGND
VREF
AGND
SENSE
AGND
REFT, REFB
AGND
ENVIRONMENTAL
Storage Temperature
Operating Temperature Range
Lead Temperature Range
(Soldering 10 sec)
Junction Temperature
Rev. 0 | Page 8 of 40
Parameter
Min
0.3
0.3
0.3
0.3
4
4
4
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–65
–40
Max
+4
+6
+4
+0.3
+4
+6
+6
DRVDD + 0.3
AVDD1 + 0.3
AVDD2 + 0.3
AVDD1 + 0.3
AVDD1 + 0.3
AVDD1 + 0.3
+125
+85
300
Unit
V
V
V
V
V
V
V
V
V
V
V
V
V
°C
°C
°C
150
°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Thermal Resistance
The heat sink of the AD9444 package must be soldered to
ground.
Table 6.
Package Type
θ
JA
100-Lead TQFP/EP
19.8
θ
JB
8.3
θ
JC
2
Unit
°C/W
Typical θ
JA
= 19.8°C/W (heat-sink soldered) for multilayer
board in still air.
Typical θ
JB
= 8.3°C/W (heat-sink soldered) for multilayer board
in still air.
Typical θ
JC
= 2°C/W (junction to exposed heat sink) represents
the thermal resistance through heat-sink path.
Airflow increases heat dissipation effectively reducing θ
JA
. Also,
more metal directly in contact with the package leads, from
metal traces, through holes, ground, and power planes, reduces
the θ
JA
. It is required that the exposed heat sink be soldered to
the ground plane.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features proprie-
tary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic
discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of
functionality.
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| AD9444BSVZ-80 | 功能描述:IC ADC 14BIT 80MSPS 100TQFP RoHS:是 類別:集成電路 (IC) >> 數據采集 - 模數轉換器 系列:- 其它有關文件:TSA1204 View All Specifications 標準包裝:1 系列:- 位數:12 采樣率（每秒）:20M 數據接口:并聯 轉換器數目:2 功率耗散（最大）:155mW 電壓電源:模擬和數字 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:48-TQFP 供應商設備封裝:48-TQFP（7x7） 包裝:Digi-Reel® 輸入數目和類型:4 個單端，單極；2 個差分，單極 產品目錄頁面:1156 (CN2011-ZH PDF) 其它名稱:497-5435-6 |
| AD9444-CMOS/PCB | 制造商:Analog Devices 功能描述:Evaluation Kit For 14-Bit, 80 MSPS, A/D Converter |
| AD9444-CMOSPCB | 制造商:AD 制造商全稱:Analog Devices 功能描述:High Speed ADC USB FIFO Evaluation Kit |
| AD9444-LVDS/PCB | 制造商:Analog Devices 功能描述:14-BIT, 80 MSPS ADC PB FREE EVAL BD. - Trays |
| AD9444-LVDS/PCBZ | 制造商:Analog Devices 功能描述:LVDS Mode Evaluation Board 制造商:Analog Devices 功能描述:14-BIT, 80 MSPS ADC EVAL BD. - Bulk |
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