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參數資料
| 型號： | ADP3179JRU |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 穩壓器 |
| 英文描述： | PRECISION THERMOSTATS |
| 中文描述： | SWITCHING CONTROLLER, PDSO20 |
| 封裝： | TSSOP-20 |
| 文件頁數： | 13/16頁 |
| 文件大小： | 231K |
| 代理商： | ADP3179JRU |
REV. A
ADP3159/ADP3179
–13–
8.
A power Schottky diode (1 ~ 2 A dc rating) placed from the
lower MOSFET
’
s source (anode) to drain (cathode) will
help to minimize switching power dissipation in the upper
MOSFET. In the absence of an effective Schottky diode,
this dissipation occurs through the following sequence of
switching events. The lower MOSFET turns off in advance
of the upper MOSFET turning on (necessary to prevent
cross-conduction). The circulating current in the power
converter, no longer finding a path for current through the
channel of the lower MOSFET, draws current through the
inherent body-drain diode of the MOSFET. The upper
MOSFET turns on, and the reverse recovery characteristic
of the lower MOSFET
’
s body-drain diode prevents the drain
voltage from being pulled high quickly. The upper MOSFET
then conducts very large current while it momentarily has a
high voltage forced across it, which translates into added
power dissipation in the upper MOSFET. The Schottky diode
minimizes this problem by carrying a majority of the circu-
lating current when the lower MOSFET is turned off, and
by virtue of its essentially nonexistent reverse recovery time.
Whenever a power-dissipating component (e.g., a power
MOSFET) is soldered to a PCB, the liberal use of vias,
both directly on the mounting pad and immediately sur-
rounding it, is recommended. Two important reasons for
this are: improved current rating through the vias (if it is
a current path), and improved thermal performance
—
especially if the vias extend to the opposite side of the PCB
where a plane can more readily transfer the heat to the air.
9.
10. The output power path, though not as critical as the switch-
ing power path, should also be routed to encompass a small
area. The output power path is formed by the current path
through the inductor, the current sensing resistor, the out-
put capacitors, and back to the input capacitors.
11. For best EMI containment, the ground plane should extend
fully under all the power components. These are: the input
capacitors, the power MOSFETs and Schottky diode, the
inductor, the current sense resistor, any snubbing elements
that might be added to dampen ringing, and the output
capacitors.
Signal Circuitry
12. The output voltage is sensed and regulated between the
GND pin (which connects to the signal ground plane) and
the CS
–
pin. The output current is sensed (as a voltage) and
regulated between the CS
–
pin and the CS+ pin. In order to
avoid differential mode noise pickup in those sensed signals,
their loop areas should be small. Thus the CS
–
trace should
be routed atop the signal ground plane, and the CS+ and
CS
–
traces should be routed as a closely coupled pair (CS+
should be over the signal ground plane as well).
13. The CS+ and CS
–
traces should be Kelvin-connected to
the current sense resistor so that the additional voltage drop
due to current flow on the PCB at the current sense resistor
connections does not affect the sensed voltage. It is desir-
able to have the ADP3159 close to the output capacitor
bank and not in the output power path, so that any voltage
drop between the output capacitors and the GND pin is
minimized, and voltage regulation is not compromised.
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