
REV. A
ADP3159/ADP3179
–3–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADP3159 and the ADP3179 feature proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ORDERING GUIDE
Temperature
Range
0
°
C to 70
°
C
0
°
C to 70
°
C
LDO
Voltage
Package
Description
Package
Option
Model
ADP3159JRU
ADP3179JRU
2.5 V, 1.8 V
Adjustable
Thin Shrink Small Outline
Thin Shrink Small Outline
RU-20
RU-20
ABSOLUTE MAXIMUM RATINGS
*
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +15 V
DRVH, DRVL, LRDRV1, LRDRV2 . . . . –0.3 V to VCC + 0.3 V
All Other Inputs and Outputs . . . . . . . . . . . . –0.3 V to +10 V
Operating Ambient Temperature Range . . . . . . . 0
°
C to 70
°
C
Operating Junction Temperature . . . . . . . . . . . . . . . . . 125
°
C
Storage Temperature Range . . . . . . . . . . . . –65
°
C to +150
°
C
θ
JA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
°
C/W
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . 300
°
C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°
C
*
This is a stress rating only; operation beyond these limits can cause the device to
be permanently damaged. Unless otherwise specified, all voltages are referenced
to GND.
PIN FUNCTION DESCRIPTIONS
Pin
Mnemonic
Function
1, 19 NC
2–5
No Connection.
VID3, VID2, Voltage Identification DAC Inputs. These
VID1, VID0
pins are pulled up to an internal reference,
providing a Logic One if left open. The
DAC output programs the FB regulation
voltage from 1.3 V to 2.05 V.
PWRGD
Open drain output that signals when the
output voltage is in the proper operating
range.
7, 15 LRFB1,
Feedback connections for the linear
LRFB2
regulator controllers.
8, 14 LRDRV1,
Gate drives for the respective linear
LRDRV2
regulator N-channel MOSFETs.
9
FB
Feedback Input. Error amplifier input for
remote sensing of the output voltage.
10
CS–
Current Sense Negative Node. Negative
input for the current comparator.
11
CS+
Current Sense Positive Node. Positive
input for the current comparator. The
output current is sensed as a voltage at this
pin with respect to CS–.
12
CT
External capacitor connected from CT to
ground sets the Off-time of the device.
13
COMP
Error Amplifier Output and Compensation
Point. The voltage at this output programs
the output current control level between
CS+ and CS–.
16
VCC
Supply Voltage for the device.
17
DRVL
Low-Side MOSFET Drive. Gate drive for
the synchronous rectifier N-channel
MOSFET. The voltage at DRVL swings
from GND to VCC.
18
DRVH
High-side MOSFET Drive. Gate drive for
the buck switch N-channel MOSFET.
The voltage at DRVH swings from GND
to VCC.
20
GND
Ground Reference. GND should have a
low impedance path to the source of hte
synchronous MOSFET.
6
PIN CONFIGURATION
RU-20
TOP VIEW
(Not to Scale)
20
19
18
17
16
15
14
13
12
11
1
2
3
4
5
6
7
8
9
10
ADP3159/
ADP3179
NC = NO CONNECT
CS
–
FB
LRDRV1
VID0
VID1
VID2
LRFB1
PWRGD
VID3
CS+
CT
COMP
NC
DRVH
DRVL
LRDRV2
LRFB2
VCC
NC
GND