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參數資料
| 型號： | ADSP-21365 |
| 廠商： | Analog Devices, Inc. |
| 元件分類： | 數字信號處理 |
| 英文描述： | SHARC Processor |
| 中文描述： | SHARC處理器 |
| 文件頁數： | 16/54頁 |
| 文件大小： | 559K |
| 代理商： | ADSP-21365 |
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Rev. PrA
|
Page 16 of 54
|
September 2004
ADSP-21365/6
Preliminary Technical Data
MAXIMUM POWER DISSIPATION
The data in this table is based on theta JA (
θ
JA
) established per
JEDEC standards JESD51-2 and JESD51-6. See Engineer-to-
Engineer note (EE-TBD) for further information. For informa-
tion on package thermal specifications, see
Thermal
Characteristics on page 44
.
ABSOLUTE MAXIMUM RATINGS
ESD SENSITIVITY
TIMING SPECIFICATIONS
The ADSP-21365/6’s internal clock (a multiple of CLKIN) pro-
vides the clock signal for timing internal memory, processor
core, serial ports, and parallel port (as required for read/write
strobes in asynchronous access mode). During reset, program
the ratio between the processor’s internal clock frequency and
external (CLKIN) clock frequency with the CLKCFG1–0 pins
(see
Table 7 on page 14
). To determine switching frequencies
for the serial ports, divide down the internal clock, using the
programmable divider control of each port (DIVx for the serial
ports).
The ADSP-21365/6’s internal clock switches at higher frequen-
cies than the system input clock (CLKIN). To generate the
internal clock, the processor uses an internal phase-locked loop
Max Ambient
Temp
1
70
°
C
85
°
C
105
°
C
1
Power Dissipation greater than that listed above may cause permanent damage to the device.
For more information, see Thermal Characteristics on page 44.
2
Heat slug soldered to PCB
3
Heat slug not soldered to PCB
4
Thermal vias in PCB
5
No thermal vias in PCB
144 INT–HS
LQFP
2
3.33W
2.42W
1.21W
144 INT–HS
LQFP
3
2.10W
N/A
N/A
136 Mini-
BGA
4
2.44W
1.77W
N/A
136 Mini-
BGA
5
2.18W
N/A
N/A
Parameter
Internal (Core) Supply Voltage (V
DDINT
)
1
Analog (PLL) Supply Voltage (A
VDD
)
1
External (I/O) Supply Voltage (V
DDEXT
)
1
Input Voltage–0.5 V to V
DDEXT
1
Output Voltage Swing–0.5 V to V
DDEXT
1
Load Capacitance
1
Storage Temperature Range
1
Junction Temperature under Bias
Rating
–0.3 V to +1.5 V
–0.3 V to +1.5 V
–0.3 V to +4.6 V
+ 0.5 V
+ 0.5 V
200 pF
–65
°
C to +150
°
C
125
°
C
1
Stresses greater than those listed above may cause permanent damage to the device.
These are stress ratings only; functional operation of the device at these or any other
conditions greater than those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods
may affect device reliability.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADSP-21365/6 features proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
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相關代理商/技術參數 |
參數描述 |
|---|---|
| ADSP-21365BBC-1AA | 制造商:Analog Devices 功能描述:DSP Floating-Point 32-Bit/40-Bit 333MHz 333MIPS 136-Pin CSP-BGA |
| ADSP-21365BBCZ-1AA | 功能描述:IC DSP 32BIT 333MHZ 136-CSPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP（數字式信號處理器） 系列:SHARC® 標準包裝:2 系列:StarCore 類型:SC140 內核 接口:DSI，以太網，RS-232 時鐘速率:400MHz 非易失內存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA，FCBGA 供應商設備封裝:431-FCPBGA（20x20） 包裝:托盤 |
| ADSP-21365BSWZ-1AA | 功能描述:IC DSP 32BIT 333MHZ EPAD 144LQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP（數字式信號處理器） 系列:SHARC® 標準包裝:2 系列:StarCore 類型:SC140 內核 接口:DSI，以太網，RS-232 時鐘速率:400MHz 非易失內存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA，FCBGA 供應商設備封裝:431-FCPBGA（20x20） 包裝:托盤 |
| ADSP-21365KBC-1AA | 制造商:Analog Devices 功能描述:DSP Floating-Point 32-Bit/40-Bit 333MHz 333MIPS 136-Pin CSP-BGA |
| ADSP-21365KBCZ1AA | 制造商:Analog Devices 功能描述:DSP FLOATING PT 32BIT/40-BIT 333MHZ 333MIPS 136CSPBGA - Trays |
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