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參數(shù)資料
型號: ADSP-21365SBBCZENG
廠商: ANALOG DEVICES INC
元件分類: 數(shù)字信號處理
英文描述: SHARC Processor
中文描述: 16-BIT, 55.55 MHz, OTHER DSP, PBGA136
封裝: LEAD FREE, MO-205AE, MBGA-136
文件頁數(shù): 52/54頁
文件大小: 559K
代理商: ADSP-21365SBBCZENG
Rev. PrA
|
Page 52 of 54
|
September 2004
ADSP-21365/6
Preliminary Technical Data
Table 45. ADSP-21365 Ordering Guide
Part Number
1,
2,
3
Ambient
Temperature
Range
°
C
0 to 70
0 to 70
0 to 70
0 to 70
–40 to 85
–40 to 85
–40 to 85
–40 to 85
–40 to 105
–40 to 105
Instruction
Rate
On-Chip
SRAM
ROM
Operating Voltage
Internal/External
Volts
1.2/3.3
1.2/3.3
1.2/3.3
1.2/3.3
1.2/3.3
1.2/3.3
1.2/3.3
1.2/3.3
1.0/3.3
1.0/3.3
Package
ADSP-21365SKBCZENG
ADSP-21365SKBC-ENG
ADSP-21365SKSQZENG
ADSP-21365SKSQ-ENG
ADSP-21365SBBCZENG
4
ADSP-21365SBBC-ENG
4
ADSP-21365SBSQZENG
5
ADSP-21365SBSQ-ENG
5
ADSP-21365SCSQZENG
5
ADSP-21365SCSQ-ENG
5
333MHz
333MHz
333MHz
333MHz
333MHz
333MHz
333MHz
333MHz
200MHz
200MHz
3M bit
3M bit
3M bit
3M bit
3M bit
3M bit
3M bit
3M bit
3M bit
3M bit
4M bit
4M bit
4M bit
4M bit
4M bit
4M bit
4M bit
4M bit
4M bit
4M bit
136 Mini-BGA Pb-free
136 Mini-BGA
144 INT–HS LQFP Pb-free
144 INT–HS LQFP
136 Mini-BGA Pb-free
136 Mini-BGA
144 INT–HS LQFP Pb-free
144 INT–HS LQFP
144 INT–HS LQFP Pb-free
144 INT–HS LQFP
1
Z indicates Lead Free package. For more information about lead free package offerings, please visit www.analog.com.
2
See
Thermal Characteristics on page 44
for information on package thermal specifications.
3
See Engineer–to–Engineer Note TBD for further information.
4
PCB must have thermal vias. See
Thermal Characteristics on page 44
. For more information see Jedec Standard JESD51-9.
5
Heat slug must be soldered to the PCB. See
Thermal Characteristics on page 44
. For more information see Jedec Standard JESD51-5.
Table 46. ADSP-21366 Ordering Guide
Part Number
1,
2,
3
Ambient
Temperature
Range
°
C
0 to 70
0 to 70
0 to 70
0 to 70
–40 to 85
–40 to 85
–40 to 85
–40 to 85
–40 to 105
–40 to 105
Instruction
Rate
On-Chip
SRAM
ROM
Operating Voltage
Internal/External
Volts
1.2/3.3
1.2/3.3
1.2/3.3
1.2/3.3
1.2/3.3
1.2/3.3
1.2/3.3
1.2/3.3
1.0/3.3
1.0/3.3
Package
ADSP-21366SKBCZENG
ADSP-21366SKBC-ENG
ADSP-21366SKSQZENG
ADSP-21366SKSQ-ENG
ADSP-21366SBBCZENG
4
ADSP-21366SBBC-ENG
4
ADSP-21366SBSQZENG
5
ADSP-21366SBSQ-ENG
5
ADSP-21366SCSQZENG
5
ADSP-21366SCSQ-ENG
5
333MHz
333MHz
333MHz
333MHz
333MHz
333MHz
333MHz
333MHz
200MHz
200MHz
3M bit
3M bit
3M bit
3M bit
3M bit
3M bit
3M bit
3M bit
3M bit
3M bit
4M bit
4M bit
4M bit
4M bit
4M bit
4M bit
4M bit
4M bit
4M bit
4M bit
136 Mini-BGA Pb-free
136 Mini-BGA
144 INT–HS LQFP Pb-free
144 INT–HS LQFP
136 Mini-BGA Pb-free
136 Mini-BGA
144 INT–HS LQFP Pb-free
144 INT–HS LQFP
144 INT–HS LQFP Pb-free
144 INT–HS LQFP
1
Z indicates Lead Free package. For more information about lead free package offerings, please visit www.analog.com.
2
See
Thermal Characteristics on page 44
for information on package thermal specifications.
3
See Engineer–to–Engineer Note TBD for further information.
4
PCB must have thermal vias. See
Thermal Characteristics on page 44
. For more information see JEDEC Standard JESD51-9.
5
Heat slug must be soldered to the PCB. See
Thermal Characteristics on page 44
. For more information see JEDEC Standard JESD51-5.
相關(guān)PDF資料
PDF描述
ADSP-21365SBSQ-ENG SHARC Processor
ADSP-21365SKBCZENG SHARC Processor
ADSP-21365SKSQZENG SHARC Processor
ADSP-21366SKBCZENG SHARC Processor
ADSP-21366SBBCZENG SHARC Processor
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ADSP-21365SBSQ-ENG 制造商:AD 制造商全稱:Analog Devices 功能描述:SHARC Processor
ADSP-21365SBSQZENG 制造商:AD 制造商全稱:Analog Devices 功能描述:SHARC Processor
ADSP-21365SCSQ-ENG 制造商:AD 制造商全稱:Analog Devices 功能描述:SHARC Processor
ADSP-21365SCSQZENG 制造商:AD 制造商全稱:Analog Devices 功能描述:SHARC Processor
ADSP-21365SKBC-ENG 制造商:AD 制造商全稱:Analog Devices 功能描述:SHARC Processor
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