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參數資料
| 型號： | GTL1655DGG |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 電壓/頻率轉換 |
| 英文描述： | 16-bit LVTTL-to-GTL-GTL+ bus transceiver with live insertion |
| 封裝： | GTL1655DGG<SOT646-1 (TSSOP64)|<<http://www.nxp.com/packages/SOT646-1.html<1<week 3, 2006,;GTL1655DGG<SOT646-1 (TSSOP64)|<<http://www.nxp.com/packages/SOT646-1.html<1&l |
| 文件頁數： | 21/23頁 |
| 文件大?。?/td> | 127K |
| 代理商： | GTL1655DGG |
Philips Semiconductors
GTL1655
16-bit LVTTL-to-GTL/GTL+ bus transceiver with live insertion
Product data
Rev. 01 — 11 May 2004
21 of 23
9397 750 12936
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or
larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than
0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex
foil by using a hot bar soldering process. The appropriate soldering profile can be provided on
request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
[4]
[5]
[6]
[7]
[8]
[9]
14. Revision history
Table 19:
Rev Date
01
Revision history
CPCN
20040511
Description
Product data (9397 750 12936).
-
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相關代理商/技術參數 |
參數描述 |
|---|---|
| GTL1655DGG,512 | 功能描述:總線收發器 16-BIT LVTTL TO GTL RoHS:否 制造商:Fairchild Semiconductor 邏輯類型:CMOS 邏輯系列:74VCX 每芯片的通道數量:16 輸入電平:CMOS 輸出電平:CMOS 輸出類型:3-State 高電平輸出電流:- 24 mA 低電平輸出電流:24 mA 傳播延遲時間:6.2 ns 電源電壓-最大:2.7 V, 3.6 V 電源電壓-最小:1.65 V, 2.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-48 封裝:Reel |
| GTL1655DGG,518 | 功能描述:總線收發器 16-BIT LVTTL TO GTL RoHS:否 制造商:Fairchild Semiconductor 邏輯類型:CMOS 邏輯系列:74VCX 每芯片的通道數量:16 輸入電平:CMOS 輸出電平:CMOS 輸出類型:3-State 高電平輸出電流:- 24 mA 低電平輸出電流:24 mA 傳播延遲時間:6.2 ns 電源電壓-最大:2.7 V, 3.6 V 電源電壓-最小:1.65 V, 2.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-48 封裝:Reel |
| GTL1655DGG-T | 功能描述:總線收發器 16-BIT LVTTL TO GTL UBT (3-S) RoHS:否 制造商:Fairchild Semiconductor 邏輯類型:CMOS 邏輯系列:74VCX 每芯片的通道數量:16 輸入電平:CMOS 輸出電平:CMOS 輸出類型:3-State 高電平輸出電流:- 24 mA 低電平輸出電流:24 mA 傳播延遲時間:6.2 ns 電源電壓-最大:2.7 V, 3.6 V 電源電壓-最小:1.65 V, 2.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-48 封裝:Reel |
| GTL16612 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:18-bit GTL/GTL+ to LVTTL/TTL bidirectional universal translator (3-State) |
| GTL16612DG | 功能描述:總線收發器 18-BIT GTL/GTL + TO LVTTL/TTL RoHS:否 制造商:Fairchild Semiconductor 邏輯類型:CMOS 邏輯系列:74VCX 每芯片的通道數量:16 輸入電平:CMOS 輸出電平:CMOS 輸出類型:3-State 高電平輸出電流:- 24 mA 低電平輸出電流:24 mA 傳播延遲時間:6.2 ns 電源電壓-最大:2.7 V, 3.6 V 電源電壓-最小:1.65 V, 2.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-48 封裝:Reel |
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