
www.irf.com
1
10/11/04
IRF6665
Notes
through are on page 2
DirectFET
ISOMETRIC
Applicable DirectFET Outline and Substrate Outline (see p. 6, 7 for details)
Description
This Digital Audio MOSFET is specifically designed for Class-D audio amplifier applications. This MOSFET utilizes the latest processing
techniques to achieve low on-resistance per silicon area. Furthermore, gate charge, body-diode reverse recovery and internal gate
resistance are optimized to improve key Class-D audio amplifier performance factors such as efficiency, THD, and EMI.
The IRF6665 device utilizes DirectFET TM packaging technology. DirectFET TM packaging technology offers lower parasitic inductance and
resistance when compared to conventional wirebonded SOIC packaging. Lower inductance improves EMI performance by reducing the voltage
ringing that accompanies fast current transients. The DirectFET TM package is compatible with existing layout geometries used in power
applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is
followed regarding the manufacturing method and processes. The DirectFET TM package also allows dual sided cooling to maximize thermal
transfer in power systems, improving thermal resistance and power dissipation. These features combine to make this MOSFET a highly efficient,
robust and reliable device for Class-D audio amplifier applications.
Absolute Maximum Ratings
Parameter
V
DS
Drain-to-Source Voltage
V
GS
Gate-to-Source Voltage
Continuous Drain Current, V
GS
@ 10V
I
D
@ T
A
= 25°C
Continuous Drain Current, V
GS
@ 10V
I
D
@ T
A
= 70°C
Continuous Drain Current, V
GS
@ 10V
I
DM
Pulsed Drain Current
P
D
@T
C
= 25°C
Maximum Power Dissipation
P
D
@T
A
= 25°C
Power Dissipation
P
D
@T
A
= 70°C
Power Dissipation
Linear Derating Factor
T
J
Operating Junction and
T
STG
Storage Temperature Range
Features
Latest MOSFET Silicon technology
Key parameters optimized for Class-D audio amplifier applications
Low R
DS(on)
for improved efficiency
Low Q
g
for better THD and improved efficiency
Low Q
rr
for better THD and lower EMI
Low package stray inductance for reduced ringing and lower EMI
Can deliver up to 100W per channel into 8
with no heatsink
Dual sided cooling compatible
Compatible with existing surface mount technologies
Lead and Bromide Free
Units
V
I
D
@ T
C
= 25°C
A
W
W/°C
°C
Thermal Resistance
Parameter
Typ.
Max.
Units
R
θ
JA
R
θ
JA
R
θ
JA
R
θ
JC
R
θ
J-PCB
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
–––
12.5
20
–––
1.4
58
–––
–––
3.0
–––
°C/W
42
2.2
1.4
Max.
100
± 20
4.2
3.4
34
19
-40 to + 150
0.017
V
DS
R
DS(on)
typ. @ V
GS
= 10V
Q
g
typ.
R
G(int)
typ.
100
53
8.7
1.9
V
m
nC
Key Parameters
SQ
SX
ST
SH
MQ
MX
MT
MN