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參數資料
| 型號： | ISP1130N |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | Universal Serial Bus compound hub with integrated keyboard controller |
| 中文描述： | SPECIALTY MICROPROCESSOR CIRCUIT, PDIP56 |
| 封裝： | PLASTIC, SDIP-56 |
| 文件頁數： | 63/68頁 |
| 文件大小： | 1786K |
| 代理商： | ISP1130N |
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Philips Semiconductors
ISP1130
USB compound hub with keyboard controller
Objective specification
Rev. 01 — 23 March 2000
63 of 68
9397 750 06895
Philips Electronics N.V. 2000. All rights reserved.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time is 4 seconds at 250
°
C. A mildly-activated flux will eliminate the
need for removal of corrosive residues in most applications.
20.2.3
Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300
°
C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
°
C.
20.3 Through-hole mount packages
20.3.1
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is 260
°
C; solder at this
temperature must not be in contact with the joints for more than 5 seconds. The total
contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specified maximum storage temperature (T
stg(max)
).
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
20.3.2
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300
°
C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400
°
C, contact may be up to 5 seconds.
相關PDF資料 |
PDF描述 |
|---|---|
| ISP1160 | Embedded Universal Serial Bus Host Controller |
| ISP1160BD | Embedded Universal Serial Bus Host Controller |
| ISP1160BM | Embedded Universal Serial Bus Host Controller |
| ISP1161A | Full-speed Universal Serial Bus single-chip host and device controller |
| ISP1161ABD | Full-speed Universal Serial Bus single-chip host and device controller |
相關代理商/技術參數 |
參數描述 |
|---|---|
| ISP1160 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Embedded Universal Serial Bus Host Controller |
| ISP1160BD | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Embedded Universal Serial Bus Host Controller |
| ISP1160BD,157 | 功能描述:USB 接口集成電路 USB 1.1 HOST CONTROLLER RoHS:否 制造商:Cypress Semiconductor 產品:USB 2.0 數據速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1160BD/01 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Embedded Universal Serial Bus Host Controller |
| ISP1160BD/01,118 | 功能描述:USB 接口集成電路 USB HOST CTRL RoHS:否 制造商:Cypress Semiconductor 產品:USB 2.0 數據速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
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