- 您現在的位置：買賣IC網 > PDF目錄360998 > ISP1130N (NXP SEMICONDUCTORS) Universal Serial Bus compound hub with integrated keyboard controller PDF資料下載
參數資料
| 型號： | ISP1130N |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | Universal Serial Bus compound hub with integrated keyboard controller |
| 中文描述： | SPECIALTY MICROPROCESSOR CIRCUIT, PDIP56 |
| 封裝： | PLASTIC, SDIP-56 |
| 文件頁數： | 64/68頁 |
| 文件大小： | 1786K |
| 代理商： | ISP1130N |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁當前第64頁第65頁第66頁第67頁第68頁
Philips Semiconductors
ISP1130
USB compound hub with keyboard controller
Objective specification
Rev. 01 — 23 March 2000
64 of 68
9397 750 06895
Philips Electronics N.V. 2000. All rights reserved.
20.4 Package related soldering information
[1]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board
and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top
version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger
than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[2]
[3]
[4]
[5]
[6]
Table 93: Suitability of IC packages for wave, reflow and dipping soldering methods
Mounting
Package
Soldering method
Wave
Reflow
[1]
Dipping
Through-hole
mount
Surface mount
DBS, DIP, HDIP, SDIP, SIL suitable
[2]
suitable
BGA, LFBGA, SQFP,
TFBGA
HBCC, HLQFP, HSQFP,
HSOP, HTQFP, HTSSOP,
SMS
PLCC
[4]
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
suitable
not suitable
[3]
suitable
suitable
not recommended
[4] [5]
suitable
not recommended
[6]
suitable
suitable
相關PDF資料 |
PDF描述 |
|---|---|
| ISP1160 | Embedded Universal Serial Bus Host Controller |
| ISP1160BD | Embedded Universal Serial Bus Host Controller |
| ISP1160BM | Embedded Universal Serial Bus Host Controller |
| ISP1161A | Full-speed Universal Serial Bus single-chip host and device controller |
| ISP1161ABD | Full-speed Universal Serial Bus single-chip host and device controller |
相關代理商/技術參數 |
參數描述 |
|---|---|
| ISP1160 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Embedded Universal Serial Bus Host Controller |
| ISP1160BD | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Embedded Universal Serial Bus Host Controller |
| ISP1160BD,157 | 功能描述:USB 接口集成電路 USB 1.1 HOST CONTROLLER RoHS:否 制造商:Cypress Semiconductor 產品:USB 2.0 數據速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1160BD/01 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Embedded Universal Serial Bus Host Controller |
| ISP1160BD/01,118 | 功能描述:USB 接口集成電路 USB HOST CTRL RoHS:否 制造商:Cypress Semiconductor 產品:USB 2.0 數據速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
發布緊急采購，3分鐘左右您將得到回復。