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參數(shù)資料
| 型號(hào)： | MAX6581TG9A+ |
| 廠商： | Maxim Integrated |
| 文件頁(yè)數(shù)： | 24/27頁(yè) |
| 文件大小： | 1212K |
| 描述： | IC TEMP SENSOR 8-CH PREC 24-TQFN |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 75 |
| 功能： | 溫度監(jiān)控器 |
| 傳感器類(lèi)型： | 內(nèi)部和外部 |
| 感應(yīng)溫度： | -64°C ~ 150°C |
| 精確度： | ±3°C 本地（最大），±2.5°C 遠(yuǎn)程（最大） |
| 輸出類(lèi)型： | I²C?/SMBus? |
| 輸出警報(bào)： | 是 |
| 輸出風(fēng)扇： | 是 |
| 電源電壓： | 3 V ~ 3.6 V |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類(lèi)型： | 表面貼裝 |
| 封裝/外殼： | 24-WFQFN 裸露焊盤(pán) |
| 供應(yīng)商設(shè)備封裝： | 24-TQFN-EP（4x4） |
| 包裝： | 管件 |
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24
Maxim Integrated
?癈 Accurate 8-Channel Temperature Sensor
MAX6581
Thermal Mass and Self-Heating
When sensing local temperature, the MAX6581 mea-
sures the temperature of the PCB to which it is soldered.
The leads provide a good thermal path between the PCB
traces and the die. As with all IC temperature sensors,
thermal conductivity between the die and the ambient
air is poor by comparison, making air-temperature mea-
surements impractical. Since the thermal mass of the
PCB is far greater than that of the MAX6581, the device
follows temperature changes on the PCB with little or no
perceivable delay. When measuring the temperature of a
CPU, or other IC with an on-chip sense junction, thermal
mass has virtually no effect; the measured temperature
of the junction tracks the actual temperature within a
conversion cycle. When measuring temperature with
discrete remote transistors, the best thermal-response
times are obtained with transistors in small packages
(i.e., SOT23 or SC70). Take care to account for thermal
gradients between the heat source and the sensor,
and ensure that stray air currents across the sensor
package do not interfere with measurement accuracy.
Self-heating does not significantly affect measurement
accuracy. Remote-sensor self-heating due to the diode
current source is negligible.
ADC Noise Filtering
The integrating ADC has good noise rejection for low-
frequency signals, such as power-supply hum. In envi-
ronments with significant high-frequency EMI, connect
an external 100pF capacitor between DXP_ and DXN_.
Larger capacitor values can be used for added filter-
ing; however, it can introduce errors due to the rise time
of the switched current source. High-frequency noise
reduction is needed for high-accuracy remote measure-
ments. Noise can be reduced with careful PCB layout as
discussed in the PCB Layout section.
Slave Address
The slave address for the MAX6581 is shown in Table 16.
PCB Layout
Follow the guidelines below to reduce the measurement
error when measuring remote temperature:
1) Place the MAX6581 as close as possible to the
remote diode. In noisy environments, such as a com-
puter motherboard, this distance is typically 4in to
8in. This length can be increased if the worst-noise
sources are avoided. Noise sources include displays,
clock generators, memory buses, and PCI buses.
2) Do not route the DXP_DXN_ lines next to the deflec-
tion coils of a CRT. Also, do not route the traces
across fast digital signals, which can easily introduce
+30NC error, even with good filtering.
3) Route the DXP_ and DXN_ traces in parallel and in
close proximity to each other. Each parallel pair of
traces should go to a remote diode. Route these
traces away from any higher voltage traces, such as
+12V DC. Leakage currents from PCB contamination
must be dealt with carefully since a 20MI leakage
path from DXP_ to ground causes approximately
+1NC error. If high-voltage traces are unavoidable,
connect guard traces to GND on either side of the
DXP_DXN_ traces (Figure 5).
4) Route through as few vias and crossunders as possi-
ble to minimize copper/solder thermocouple effects.
5) Use wide traces when possible (5-mil to 10-mil traces
are typical). Be aware of the effect of trace resistance
on temperature readings when using long, narrow
traces.
6) When the power supply is noisy, add a resistor (up to
47I) in series with V
CC
.
Figure 5. Recommended DXP_DXN_ PCB Traces. The two
outer guard traces are recommended if high-voltage traces
are near the DXN_ and DXP_ traces.
Table 16. Slave Address
510 mils
510 mils
510 mils
MINIMUM
510 mils
GND
DXP_
DXN_
GND
DEVICE ADDRESS
A7
A6
A5
A4
A3
A2
A1
A0
1
0
0
1
1
0
1
R/W
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX6581TG9A+ | 功能描述:板上安裝溫度傳感器 1C Accurate 8Ch Temperature Sensor RoHS:否 制造商:Omron Electronics 輸出類(lèi)型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線(xiàn)接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor |
| MAX6581TG9A+T | 功能描述:板上安裝溫度傳感器 1C Accurate 8Ch Temperature Sensor RoHS:否 制造商:Omron Electronics 輸出類(lèi)型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線(xiàn)接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor |
| MAX6581TG9C+ | 功能描述:板上安裝溫度傳感器 1C Accurate 8Ch Temperature Sensor RoHS:否 制造商:Omron Electronics 輸出類(lèi)型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線(xiàn)接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor |
| MAX6581TG9C+T | 功能描述:板上安裝溫度傳感器 1C Accurate 8Ch Temperature Sensor RoHS:否 制造商:Omron Electronics 輸出類(lèi)型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線(xiàn)接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor |
| MAX6581TG9E+ | 功能描述:板上安裝溫度傳感器 1C Accurate 8Ch Temperature Sensor RoHS:否 制造商:Omron Electronics 輸出類(lèi)型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線(xiàn)接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor |
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