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參數(shù)資料
型號(hào): MMBT3906TT1
廠商: ON SEMICONDUCTOR
元件分類: 小信號(hào)晶體管
英文描述: General Purpose Transistors PNP Silicon(PNP型通用晶體管)
中文描述: 200 mA, 40 V, PNP, Si, SMALL SIGNAL TRANSISTOR
封裝: CASE 463-01, SC-75, 3 PIN
文件頁(yè)數(shù): 1/7頁(yè)
文件大小: 86K
代理商: MMBT3906TT1
Semiconductor Components Industries, LLC, 2006
January, 2006 Rev. 1
1
Publication Order Number:
MMBT3906TT1/D
MMBT3906TT1
General Purpose
Transistors
PNP Silicon
This transistor is designed for general purpose amplifier
applications. It is housed in the SOT416/SC75 package which is
designed for low power surface mount applications.
Features
PbFree Package is Available
MAXIMUM RATINGS
(T
A
= 25
°
C)
Rating
Symbol
Value
Unit
CollectorEmitter Voltage
V
CEO
40
Vdc
CollectorBase Voltage
V
CBO
40
Vdc
EmitterBase Voltage
V
EBO
5.0
Vdc
Collector Current Continuous
I
C
200
mAdc
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation,
FR4 Board (Note 1) @T
A
= 25
°
C
Derated above 25
°
C
P
D
200
1.6
mW
mW/
°
C
Thermal Resistance, JunctiontoAmbient
(Note 1)
R
JA
600
°
C/W
Total Device Dissipation,
FR4 Board (Note 2) @T
A
= 25
°
C
Derated above 25
°
C
P
D
300
2.4
mW
mW/
°
C
Thermal Resistance, JunctiontoAmbient
(Note 2)
R
JA
400
°
C/W
Junction and Storage Temperature Range
T
J
, T
stg
55 to +150
°
C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. FR4 @ Minimum Pad
2. FR4 @ 1.0
×
1.0 Inch Pad
Device
Package
Shipping
ORDERING INFORMATION
MMBT3906TT1
SOT416
CASE 463
SOT416/SC75
STYLE 1
3000 / Tape & Reel
MARKING DIAGRAM
3
2
1
GENERAL PURPOSE
AMPLIFIER TRANSISTORS
SURFACE MOUNT
COLLECTOR
3
1
BASE
2
EMITTER
2A M
2A
M
= Device Code
= Date Code*
= PbFree Package
1
MMBT3906TT1G
SOT416
(PbFree)
3000 / Tape & Reel
*Date Code orientation may vary depending
upon manufacturing location.
(Note: Microdot may be in either location)
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
http://onsemi.com
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