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參數(shù)資料
| 型號(hào)： | MR18R162GAF0-CT9 |
| 廠商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述： | (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V |
| 中文描述： | （16Mx16顯示）× 2（4/8/16）件RIMM的模塊，基于256Mb阿芯片，32秒銀行，16K/32ms參考，為2.5V |
| 文件頁數(shù)： | 16/16頁 |
| 文件大小： | 419K |
| 代理商： | MR18R162GAF0-CT9 |
Page 15
Version 1.4 July 2002
MR16R1622(4/8/G)AF0
MR18R1622(4/8/G)AF0(1)
Table Of Contents
Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Key Timing Parameters/Part Numbers . . . . . . . . . . . . . . . . 1
Module Pad Numbers and Signal Names . . . . . . . . . . . . . . 2
Module Connector Pad Description . . . . . . . . . . . . . . . 3 - 4
RIMM Module Functional Diagram . . . . . . . . . . . . . . . . . . 5
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . 6
DC Recommended Electrical Conditions . . . . . . . . . . . . . . 6
RIMM Module Supply Current Profile. . . . . . . . . . . . . . . . 7
AC Electrical Specifications . . . . . . . . . . . . . . . . . . . . . 8 - 9
Physical Dimensions -1, -2 ( For PCB ) . . . . . . . . . . 10 - 11
Physical Dimensions -3, -4 ( For Heat Spreader). . . 12 - 13
Standard RIMM Module Marking. . . . . . . . . . . . . . . . . . . 14
Copyright July 2002, Samsung Electronics.
All rights reserved.
Direct Rambus, Direct RDRAM and SO-RIMM are trade-
marks of Rambus Inc. Rambus, RDRAM, RIMM and the
Rambus Logo are registered trademarks of Rambus Inc.
This document contains advanced information that is subject
to change by Samsung Electronics without notice
Document Version 1.4
Samsung Electronics Co. Ltd.
San #16 Banwol-ri, Taean-Eup Hwasung-City,
Gyeonggi-Do, KOREA
Telephone: 82-31-208-6369
Fax: 82-31-208-6799
http://www.intl.samsungsemi.com
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