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參數資料
| 型號： | P89C669 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 80C51 8-bit microcontroller family with extended memory 96 kB Flash with 2 kB RAM |
| 中文描述： | 80C51的8位擴展內存，2 KB RAM內存96 kB閃存微控制器系列 |
| 文件頁數： | 28/33頁 |
| 文件大小： | 827K |
| 代理商： | P89C669 |
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Philips Semiconductors
P89C669
80C51 8-bit microcontroller family with extended memory
Product data
Rev. 02 — 13 November 2003
28 of 33
9397 750 12299
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
13. Soldering
13.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC packages. Wave soldering can still
be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In
these situations reflow soldering is recommended. In these situations reflow
soldering is recommended.
13.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 270
°
C depending on solder
paste material. The top-surface temperature of the packages should preferably be
kept:
below 225
°
C (SnPb process) or below 245
°
C (Pb-free process)
–
for all BGA, HTSSON..T and SSOP..T packages
–
for packages with a thickness
≥
2.5 mm
–
for packages with a thickness < 2.5 mm and a volume
≥
350 mm
3
so called
thick/large packages.
below 240
°
C (SnPb process) or below 260
°
C (Pb-free process) for packages with
a thickness < 2.5 mm and a volume < 350 mm
3
so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all
times.
13.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
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相關代理商/技術參數 |
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| P89C669BBD | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:80C51 8-bit microcontroller family with extended memory 96 kB Flash with 2 kB RAM |
| P89C669FA | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:80C51 8-bit microcontroller family with extended memory 96 kB Flash with 2 kB RAM |
| P89C669FA-S | 功能描述:IC 80C51 MCU FLASH 96K 44-PLCC RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:89C 產品培訓模塊:MCU Product Line Introduction XMEGA Introduction AVR XMEGA USB Connectivity 標準包裝:90 系列:AVR® XMEGA 核心處理器:AVR 芯體尺寸:8/16-位 速度:32MHz 連通性:I²C，IrDA，SPI，UART/USART 外圍設備:欠壓檢測/復位，DMA，POR，PWM，WDT 輸入/輸出數:50 程序存儲器容量:192KB（96K x 16） 程序存儲器類型:閃存 EEPROM 大小:4K x 8 RAM 容量:16K x 8 電壓 - 電源 (Vcc/Vdd):1.6 V ~ 3.6 V 數據轉換器:A/D 16x12b; D/A 2x12b 振蕩器型:內部 工作溫度:-40°C ~ 85°C 封裝/外殼:64-TQFP 包裝:托盤 配用:ATSTK600-RC14-ND - STK600 SOCKET/ADAPTER 64TQFPATSTK600-TQFP64-ND - STK600 SOCKET/ADAPTER 64-TQFPATAVRONEKIT-ND - KIT AVR/AVR32 DEBUGGER/PROGRMMRATAVRISP2-ND - PROGRAMMER AVR IN SYSTEM |
| P89C66X | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:On-chip Flash 8-bit microcontroller Errata Sheet |
| P89C738 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:8-bit Flash microcontrollers |
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