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參數(shù)資料
| 型號： | P89C669 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 80C51 8-bit microcontroller family with extended memory 96 kB Flash with 2 kB RAM |
| 中文描述： | 80C51的8位擴展內存，2 KB RAM內存96 kB閃存微控制器系列 |
| 文件頁數(shù)： | 30/33頁 |
| 文件大小： | 827K |
| 代理商： | P89C669 |
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Philips Semiconductors
P89C669
80C51 8-bit microcontroller family with extended memory
Product data
Rev. 02 — 13 November 2003
30 of 33
9397 750 12299
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex
foil by using a hot bar soldering process. The appropriate soldering profile can be provided on
request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
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相關PDF資料 |
PDF描述 |
|---|---|
| P89C669BBD | 80C51 8-bit microcontroller family with extended memory 96 kB Flash with 2 kB RAM |
| P89C669FA | 80C51 8-bit microcontroller family with extended memory 96 kB Flash with 2 kB RAM |
| P89C738BBB | 8-BIT MICROCONTROLLER |
| P89LPC921 | MINIATURE POWER RELAY |
| P89LPC922 | MINIATURE POWER RELAY |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| P89C669BBD | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:80C51 8-bit microcontroller family with extended memory 96 kB Flash with 2 kB RAM |
| P89C669FA | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:80C51 8-bit microcontroller family with extended memory 96 kB Flash with 2 kB RAM |
| P89C669FA-S | 功能描述:IC 80C51 MCU FLASH 96K 44-PLCC RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:89C 產品培訓模塊:MCU Product Line Introduction XMEGA Introduction AVR XMEGA USB Connectivity 標準包裝:90 系列:AVR® XMEGA 核心處理器:AVR 芯體尺寸:8/16-位 速度:32MHz 連通性:I²C，IrDA，SPI，UART/USART 外圍設備:欠壓檢測/復位，DMA，POR，PWM，WDT 輸入/輸出數(shù):50 程序存儲器容量:192KB（96K x 16） 程序存儲器類型:閃存 EEPROM 大小:4K x 8 RAM 容量:16K x 8 電壓 - 電源 (Vcc/Vdd):1.6 V ~ 3.6 V 數(shù)據(jù)轉換器:A/D 16x12b; D/A 2x12b 振蕩器型:內部 工作溫度:-40°C ~ 85°C 封裝/外殼:64-TQFP 包裝:托盤 配用:ATSTK600-RC14-ND - STK600 SOCKET/ADAPTER 64TQFPATSTK600-TQFP64-ND - STK600 SOCKET/ADAPTER 64-TQFPATAVRONEKIT-ND - KIT AVR/AVR32 DEBUGGER/PROGRMMRATAVRISP2-ND - PROGRAMMER AVR IN SYSTEM |
| P89C66X | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:On-chip Flash 8-bit microcontroller Errata Sheet |
| P89C738 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:8-bit Flash microcontrollers |
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