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參數資料
| 型號： | PHT6N06 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | TrenchMOS transistor Standard level FET |
| 中文描述： | TrenchMOS晶體管標準電平場效應管 |
| 文件頁數： | 2/10頁 |
| 文件大小： | 71K |
| 代理商： | PHT6N06 |
Philips Semiconductors
Product specification
TrenchMOS
transistor
Standard level FET
PHT6N06T
THERMAL RESISTANCES
SYMBOL
R
th j-sp
R
th j-amb
PARAMETER
From junction to solder point
From junction to ambient
CONDITIONS
Mounted on any PCB
Mounted on PCB of Fig.19
TYP.
12
-
MAX.
15
70
UNIT
K/W
K/W
STATIC CHARACTERISTICS
T
j
= 25C unless otherwise specified
SYMBOL
PARAMETER
V
(BR)DSS
Drain-source breakdown
voltage
V
GS(TO)
Gate threshold voltage
CONDITIONS
V
GS
= 0 V; I
D
= 0.25 mA
MIN.
55
50
2.0
1.2
-
-
-
-
-
16
-
-
TYP.
-
-
3.0
-
-
0.05
-
0.04
-
-
120
-
MAX.
-
-
4.0
-
4.4
10
100
1
10
-
150
277
UNIT
V
V
V
V
V
μ
A
μ
A
μ
A
μ
A
V
m
m
T
j
= -55C
V
DS
= V
GS
; I
D
= 1 mA
T
j
= 150C
T
j
= -55C
I
DSS
Zero gate voltage drain current
V
DS
= 55 V; V
GS
= 0 V;
T
j
= 150C
I
GSS
Gate source leakage current
V
GS
=
±
10 V
T
j
= 150C
±
V
(BR)GSS
R
DS(ON)
Gate source breakdown voltage I
G
=
±
1 mA
Drain-source on-state
resistance
V
GS
= 10 V; I
D
= 5 A
T
j
= 150C
DYNAMIC CHARACTERISTICS
T
mb
= 25C unless otherwise specified
SYMBOL
PARAMETER
g
fs
Forward transconductance
Q
g(tot)
Total gate charge
Q
gs
Gate-source charge
Q
gd
Gate-drain (Miller) charge
C
iss
Input capacitance
C
oss
Output capacitance
C
rss
Feedback capacitance
t
d on
Turn-on delay time
t
r
Turn-on rise time
t
d off
Turn-off delay time
t
f
Turn-off fall time
CONDITIONS
V
DS
= 25 V; I
D
= 5 A; T
j
= 25C
I
D
= 5 A; V
DD
= 44 V; V
GS
= 10 V
MIN.
0.5
-
-
-
TYP.
2.5
6
1.5
4
MAX.
-
-
-
-
UNIT
S
nC
nC
nC
V
GS
= 0 V; V
DS
= 25 V; f = 1 MHz
-
-
-
-
-
-
-
190
65
32
9
28
15
8
240
80
45
14
42
23
12
pF
pF
pF
ns
ns
ns
ns
V
DD
= 30 V; I
D
= 5 A;
V
GS
= 10 V; R
G
= 10
;
T
j
= 25C
REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS
T
j
= -55 to 175C unless otherwise specified
SYMBOL
PARAMETER
I
DR
Continuous reverse drain
current
I
DRM
Pulsed reverse drain current
V
SD
Diode forward voltage
t
rr
Reverse recovery time
Q
rr
Reverse recovery charge
CONDITIONS
T
sp
= 25C
MIN.
-
TYP.
-
MAX.
5.5
UNIT
A
T
sp
= 25C
I
F
= 2 A; V
GS
= 0 V
I
F
= 2 A; -dI
/dt = 100 A/
μ
s;
V
GS
= -10 V; V
R
= 30 V
-
-
-
-
-
30
1.1
-
-
A
V
ns
μ
C
0.85
43
0.16
September 1997
2
Rev 1.000
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| PHT6N06LT | 制造商:NXP Semiconductors 功能描述:MOSFET N SOT-223 制造商:NXP Semiconductors 功能描述:MOSFET, N, SOT-223 制造商:NXP Semiconductors 功能描述:MOSFET N-Channel 55V 5.5A SOT223 |
| PHT6N06LT /T3 | 功能描述:MOSFET TAPE13 PWR-MOS RoHS:否 制造商:STMicroelectronics 晶體管極性:N-Channel 汲極/源極擊穿電壓:650 V 閘/源擊穿電壓:25 V 漏極連續電流:130 A 電阻汲極/源極 RDS（導通）:0.014 Ohms 配置:Single 最大工作溫度: 安裝風格:Through Hole 封裝 / 箱體:Max247 封裝:Tube |
| PHT6N06LT,135 | 功能描述:MOSFET TAPE13 PWR-MOS RoHS:否 制造商:STMicroelectronics 晶體管極性:N-Channel 汲極/源極擊穿電壓:650 V 閘/源擊穿電壓:25 V 漏極連續電流:130 A 電阻汲極/源極 RDS（導通）:0.014 Ohms 配置:Single 最大工作溫度: 安裝風格:Through Hole 封裝 / 箱體:Max247 封裝:Tube |
| PHT6N06LT | 制造商:NXP Semiconductors 功能描述:MOSFET N SOT-223 |
| PHT6N06LT.135 | 制造商:NXP Semiconductors 功能描述:MOSFET N REEL 4K |
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