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參數(shù)資料
型號: TLE7824G
廠商: INFINEON TECHNOLOGIES AG
元件分類: 模擬信號調(diào)理
英文描述: SPECIALTY ANALOG CIRCUIT, PDSO28
封裝: GREEN, PLASTIC,SOP-28
文件頁數(shù): 29/53頁
文件大小: 900K
代理商: TLE7824G
Data Sheet
35
Rev. 3.01, 2008-04-15
TLE7824G
General Product Characteristics
Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are
not designed for continuous repetitive operation.
16.2
Functional Range
16.3
Thermal Resistance
Table 13
Operating Range
Pos.
Parameter
Symbol
Limit Values
Unit
Conditions
Min.
Max.
16.2.1
Supply voltage
V
S
3.9
27
V
40 V load dump;
t
0.4 s;
27V jump start;
t
60s;
V
S (min) valid for ramp-down
16.2.2
Voltage range at LSx pins
V
LSx
-0.3
27
V
40 V load dump;
t
0.4s;
can withstand short circuit
to
V
S ≤ 20V
16.2.3
External output current at pin
V
CC ICC_ext
5
mA
external loads
16.2.4
Supply voltage slew rate
d
V
S/dt
-0.5
5
V/
μs–
16.2.5
Logic input voltage (TMS, TCK,
TDI, CLKIN)
V
I
-0.3
V
CC +
0.3 V
V–
16.2.6
Output capacitor connected to
V
CC pin
C
CC
1–
μF
ESR < 6
Ω
@
f = 10 kHz;
100 nF in parallel
recommended
16.2.7
SPI clock frequency
f
clk
–4
MHz
16.2.8
Junction temperature
T
j
-40
150
°C–
16.2.9
Delay time for operating mode
change
t
chmode
10
μs
min. time between 2 SPI
commands; CSN “high”
Pos.
Parameter
Symbol
Limit Values
Unit
Conditions
Min.
Typ.
Max.
16.3.1
Junction to Soldering Point1)
1) Not subject to production test, specified by design
R
thJSP
17
K/W
measured to pin
7,8,22
16.3.2
Junction to Ambient1)
R
thJA
–43
K/W
2)
2) Specified RthJA value is according to Jedec JESD51-2,-7 at natural convection on FR4 2s2p board; The Product
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70m Cu, 2 x 35m Cu).
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