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參數資料
| 型號： | TPS2492PW |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 電源管理 |
| 英文描述： | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO14 |
| 封裝： | GREEN, PLASTIC, TSSOP-14 |
| 文件頁數： | 12/33頁 |
| 文件大小： | 1096K |
| 代理商： | TPS2492PW |
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SLUSA65A – JULY 2010 – REVISED AUGUST 2010
www.ti.com
PRODUCT INFORMATION(1)
TEMPERATURE
FUNCTION
PACKAGE
PART NUMBER
Latched
TPS2492PW
-40°C to 85°C
PW14
Retry
TPS2493PW
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder on www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
over recommended TJ and voltages with respect to GND (unless otherwise noted)
VALUE
UNIT
VCC, SENSE, UVEN, OUT
-0.3 to 100
Input voltage range
PROG, OV
-0.3 to 6
VCC – SENSE
Differential voltage
-1.5 to 1.5
V
GATE, PG, FLT
-0.3 to 100
Output voltage range
TIMER, VREF, IMON
-0.3 to 6
PG, FLT
10
Sink current
PROG
2
mA
VREF
Source current
2
HBM
2
ESD rating
kV
CDM
0.5
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
THERMAL METRIC(1)
VALUE
UNITS
qJA
Junction-to-ambient thermal resistance(2)
116.4
qJB
Junction-to-board thermal resistance(3)
53.8
°C/W
yJT
Junction-to-top characterization parameter(4)
1.4
yJB
Junction-to-board characterization parameter(5)
58.8
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3)
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(4)
The junction-to-top characterization parameter, yJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining qJA, using a procedure described in JESD51-2a (sections 6 and 7).
(5)
The junction-to-board characterization parameter, yJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining qJA , using a procedure described in JESD51-2a (sections 6 and 7).
RECOMMENDED OPERATING CONDITIONS
over recommended TJ and voltages with respect to GND (unless otherwise noted)
MIN
NOM
MAX
UNIT
VCC
9
80
Input voltage range
V
PROG
0.4
4
Sourcing current
0
1
mA
VREF
capacitive loading
0
1000
pF
IMON
Sourcing current
1.9
mA
TJ
Junction operating temperature
-40
125
°C
2
Copyright 2010, Texas Instruments Incorporated
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