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參數(shù)資料
型號(hào): TS8387VF_
元件分類: ADC
英文描述: 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQFP68
封裝: CERAMIC, QFP-68
文件頁(yè)數(shù): 7/38頁(yè)
文件大小: 617K
代理商: TS8387VF_
TS8387
15/38
4.4.
THERMAL CHARACTERISTICS
Although the power dissipation is low for this performance, the use of an heat sink is mandatory.
You will find here below some advise on this topics.
HThermal resistance – junction to ambient
Air flow
ja Thermal resistance
°C/Watt
CQFP 68 on board
Air flow
speed m/s
Estimated
Targeted
No heatsink
With heatsink
24 x 24 x 16 mm
0
50
33
0.5
40
18
1
35
14
1.5
32
12
2
30
11
2.5
28
10
3
26
10
4
24
9
5
23
8
Heatsink glued to backside of package
or pressed with thermal grease
0
10
20
30
40
50
60
01
23
4
5
6
RTH ja estimated value for CQFP68 / without heatsink
+ targeted value CQFP68 with external heatsink
Thermal
resistance
junction
to
air
(degree
C/Watt)
Air flow speed (m/s)
Without Heatsink
24 x 24 x 16 mm heatsink
HThermal resistance – junction to case :
Rthjc = 6
° C/W (typical value).
. . .
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