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參數資料
| 型號： | 48SD6404RPFK |
| 廠商： | MAXWELL TECHNOLOGIES |
| 元件分類： | DRAM |
| 英文描述： | 256 Mb SDRAM 16-Meg X 4-Bit X 4-Banks |
| 中文描述： | 64M X 4 SYNCHRONOUS DRAM, 6 ns, DFP72 |
| 封裝： | DFP-72 |
| 文件頁數： | 4/42頁 |
| 文件大小： | 596K |
| 代理商： | 48SD6404RPFK |
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48SD6404
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All data sheets are subject to change without notice
2005 Maxwell Technologies
All rights reserved.
256Mb (16-Meg X 4-Bit X 4-Banks) SDRAM
01.11.05 Rev 2
the IDLE state. In addition, since the precharge for all banks is automatically performed after auto-refresh,
no precharge command is required after auto-refresh.
Self Refresh entry (SELF)1: When this command is input during the IDLE state, the SDRAM starts self-
refresh operation. After the execution of this command, self-refresh continues while CKE is Low. Since self-
refresh is performed internally and automatically, external refresh operations are unnecessary.
Power down mode entry: When this command is executed during the IDLE state, the SDRAM enters
power down mode. In power down mode, power consumption is suppresses by cutting off the initial input
circuit.
Self-refresh exit: When this command is executed during self-refresh mode, the SDRAM can exit from self-
refresh mode. After exiting from self-refresh mode, the SDRAM enters the IDLE state.
Power down exit: When this command is executed at power down mode, the SDRAM can exit from power
down mode. After exiting from power down mode, the SDRAM enters the IDLE state.
1. Self Refresh should only be used at temperatures below 70 °C
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