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| 型號(hào)： | ADSP-21364 |
| 廠(chǎng)商： | Analog Devices, Inc. |
| 元件分類(lèi)： | 數(shù)字信號(hào)處理 |
| 英文描述： | SHARC Processor |
| 中文描述： | SHARC處理器 |
| 文件頁(yè)數(shù)： | 44/52頁(yè) |
| 文件大小： | 853K |
| 代理商： | ADSP-21364 |
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Rev. PrB
|
Page 44 of 52
|
September 2004
ADSP-21364
Preliminary Technical Data
THERMAL CHARACTERISTICS
The ADSP-21364 processor is rated for performance to a maxi-
mum junction temperature of 125°C.
Table 39
airflow measurements comply with JEDEC standards
JESD51-2 and JESD51-6 and the junction-to-board measure-
ment complies with JESD51-8. Test board and thermal via
design comply with JEDEC standards JESD51-9 (Mini-BGA)
and JESD51-5 (Integrated Heatsink LQFP). The junction-to-
case measurement complies with MIL- STD-883. All measure-
ments use a 2S2P JEDEC test board.
Industrial applications using the Mini-BGA package require
thermal vias, to an embedded ground plane, in the PCB. Refer to
JEDEC Standard JESD51-9 for printed circuit board thermal
ball land and thermal via design information. Industrial applica-
tions using the LQFP package require thermal trace squares and
thermal vias, to an embedded ground plane, in the PCB. The
bottom side heat slug must be soldered to the thermal trace
squares. Refer to JEDEC Standard JESD51-5 for more
information.
To determine the Junction Temperature of the device while on
the application PCB, use:
where:
T
J
= Junction temperature ×C
T
CASE
= Case temperature (×C) measured at the top center of
the package
Ψ
JT
= Junction-to-Top (of package) characterization parameter
is the Typical value from
Table 39
and
Table 41
.
P
D
= Power dissipation (see EE Note #216)
Values of
θ
JA
are provided for package comparison and PCB
design considerations.
θ
JA
can be used for a first order approxi-
mation of T
J
by the equation:
where:
T
A
= Ambient Temperature
0
C
Values of
θ
JC
are provided for package comparison and PCB
design considerations when an external heatsink is required.
Values of
θ
JB
are provided for package comparison and PCB
design considerations.
Figure 41. Typical Output Delay or Hold vs. Load Capacitance
(at Ambient Temperature)
LOAD CAPACITANCE (pF)
0
200
50
100
150
10
8
O
-4
6
0
4
2
-2
Y = 0.0488X - 1.5923
T
J
T
CASE
Ψ
JT
P
D
×
(
)
+
=
Table 39. Thermal Characteristics for 136 Ball Mini-BGA
(No thermal vias in PCB)
1
Parameter
θ
JA
θ
JMA
θ
JMA
θ
JC
Ψ
JT
Ψ
JMT
Ψ
JMT
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
25.20
21.70
20.80
5.00
0.140
0.330
0.410
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Table 40. Thermal Characteristics for 136 Ball Mini-BGA
(Thermal vias in PCB)
1
Parameter
θ
JA
θ
JMA
θ
JMA
θ
JC
Ψ
JT
Ψ
JMT
Ψ
JMT
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
22.50
19.30
18.40
5.00
0.130
0.300
0.360
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Table 41. Thermal Characteristics for 144-Lead Integrated
Heatsink (INT–HS) LQFP (With heat slug not soldered to
PCB)
1
Parameter
θ
JA
θ
JMA
θ
JMA
θ
JC
Ψ
JT
Ψ
JMT
Ψ
JMT
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
26.08
24.59
23.77
6.83
0.236
0.427
0.441
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
T
J
T
A
θ
JA
P
D
×
(
)
+
=
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ADSP-21364BBC-1AA | 制造商:Rochester Electronics LLC 功能描述: 制造商:Analog Devices 功能描述: |
| ADSP-21364BBC-1AAZ | 制造商:Analog Devices 功能描述:DSP 32BIT SHARC 333MHZ 136CSPBGA |
| ADSP-21364BBCZ-1AA | 功能描述:IC DSP 32BIT 333MHZ 136-CSPBGA RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - DSP（數(shù)字式信號(hào)處理器） 系列:SHARC® 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類(lèi)型:SC140 內(nèi)核 接口:DSI，以太網(wǎng)，RS-232 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類(lèi)型:表面貼裝 封裝/外殼:431-BFBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA（20x20） 包裝:托盤(pán) |
| ADSP-21364BSQZ-1AX | 制造商:Analog Devices 功能描述:333 MHZ, PROCESSOR W/ON CHIP ROM,S/PDIF - Trays |
| ADSP-21364BSWZ-1AA | 功能描述:IC DSP 32BIT 333MHZ EPAD 144LQFP RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - DSP（數(shù)字式信號(hào)處理器） 系列:SHARC® 標(biāo)準(zhǔn)包裝:40 系列:TMS320DM64x, DaVinci™ 類(lèi)型:定點(diǎn) 接口:I²C，McASP，McBSP 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:160kB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:0°C ~ 90°C 安裝類(lèi)型:表面貼裝 封裝/外殼:548-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:548-FCBGA（27x27） 包裝:托盤(pán) 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA |
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