- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄374037 > ADSP-BF561SBB500 (ANALOG DEVICES INC) Blackfin Embedded Symmetric Multi-Processor PDF資料下載
參數(shù)資料
| 型號(hào)： | ADSP-BF561SBB500 |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 數(shù)字信號(hào)處理 |
| 英文描述： | Blackfin Embedded Symmetric Multi-Processor |
| 中文描述： | 32-BIT, 500 MHz, OTHER DSP, PBGA297 |
| 封裝： | PLASTIC, MS-0340AAL-1, BGA-297 |
| 文件頁(yè)數(shù)： | 14/52頁(yè) |
| 文件大小： | 508K |
| 代理商： | ADSP-BF561SBB500 |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)當(dāng)前第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)
Rev. PrC
|
Page 14 of 52
|
April 2004
ADSP-BF561
Preliminary Technical Data
The BMODE pins of the Reset Configuration Register, sampled
during power-on resets and software-initiated resets, imple-
ment the following modes:
Execute from 16-bit external memory - Execution starts
from address 0x2000 0000 with 16-bit packing. The boot
ROM is bypassed in this mode. All configuration settings
are set for the slowest device possible (3-cycle hold time,
15-cycle R/W access times, 4-cycle setup).
Boot from 8/16-bit external FLASH memory – The 8/16-bit
FLASH boot routine located in boot ROM memory space is
set up using Asynchronous Memory Bank 0. All configura-
tion settings are set for the slowest device possible (3-cycle
hold time; 15-cycle R/W access times; 4-cycle setup).
Boot from SPI serial EEPROM (16-bit addressable) – The
SPI uses the PF2 output pin to select a single SPI EPROM
device, submits a read command at address 0x0000, and
begins clocking data into the beginning of L1 instruction
memory. A 16-bit addressable SPI-compatible EPROM
must be used.
For each of the boot modes, a boot loading protocol is used to
transfer program and data blocks, from an external memory
device, to their specified memory locations. Multiple memory
blocks may be loaded by any boot sequence. Once all blocks are
loaded, Core A program execution commences from the start of
L1 instruction SRAM (0xFFA0 0000). Core B remains in a held-
off state until a certain register bit is cleared. After that, Core B
will start execution at address 0xFF60 0000.
In addition, bit 4 of the Reset Configuration Register can be set
by application code to bypass the normal boot sequence during
a software reset. For this case, the processor jumps directly to
the beginning of L1 instruction memory.
INSTRUCTION SET DESCRIPTION
The Blackfin processor family assembly language instruction set
employs an algebraic syntax that was designed for ease of coding
and readability. The instructions have been specifically tuned to
provide a flexible, densely encoded instruction set that compiles
to a very small final memory size. The instruction set also pro-
vides fully featured multifunction instructions that allow the
programmer to use many of the processor core resources in a
single instruction. Coupled with many features more often seen
on microcontrollers, this instruction set is very efficient when
compiling C and C++ source code. In addition, the architecture
supports both a user (algorithm/application code) and a super-
visor (O/S kernel, device drivers, debuggers, ISRs) mode of
operations, allowing multiple levels of access to core processor
resources.
The assembly language, which takes advantage of the proces-
sor’s unique architecture, offers the following advantages:
Seamlessly integrated DSP/CPU features are optimized for
both 8-bit and 16-bit operations.
A multi-issue load/store modified-Harvard architecture,
which supports two 16-bit MAC or four 8-bit ALU + two
load/store + two pointer updates per cycle.
All registers, I/O, and memory are mapped into a unified
4G-byte memory space providing a simplified program-
ming model.
Microcontroller features, such as arbitrary bit and bit-field
manipulation, insertion, and extraction; integer operations
on 8-, 16-, and 32-bit data-types; and separate user and ker-
nel stack pointers.
Code density enhancements, which include intermixing of
16- and 32-bit instructions (no mode switching, no code
segregation). Frequently used instructions are encoded as
16-bits.
DEVELOPMENT TOOLS
The ADSP-BF561 is supported with a complete set of
CROSSCORE
TM
software and hardware development tools,
including Analog Devices emulators and the VisualDSP++
development environment. The same emulator hardware that
supports other Analog Devices processors also fully emulates
the ADSP-BF561.
The VisualDSP++ project management environment lets pro-
grammers develop and debug an application. This environment
includes an easy-to-use assembler that is based on an algebraic
syntax, an archiver (librarian/library builder), a linker, a loader,
a cycle-accurate instruction-level simulator, a C/C++ compiler,
and a C/C++ run-time library that includes DSP and mathemat-
ical functions. A key point for these tools is C/C++ code
efficiency. The compiler has been developed for efficient trans-
lation of C/C++ code to Blackfin assembly. The Blackfin
processor has architectural features that improve the efficiency
of compiled C/C++ code.
The VisualDSP++ debugger has a number of important fea-
tures. Data visualization is enhanced by a plotting package that
offers a significant level of flexibility. This graphical representa-
tion of user data enables the programmer to quickly determine
the performance of an algorithm. As algorithms grow in com-
plexity, this capability can have increasing significance on the
designer’s development schedule, increasing productivity. Sta-
tistical profiling enables the programmer to non intrusively poll
the processor as it is running the program. This feature, unique
to VisualDSP++, enables the software developer to passively
gather important code execution metrics without interrupting
the real-time characteristics of the program. Essentially, the
developer can identify bottlenecks in software quickly and effi-
ciently. By using the profiler, the programmer can focus on
those areas in the program that impact performance and take
corrective action.
Debugging both C/C++ and assembly programs with the Visu-
alDSP++ debugger, programmers can:
View mixed C/C++ and assembly code (interleaved source
and object information)
Insert breakpoints
Set conditional breakpoints on registers, memory, and
stacks
Trace instruction execution
Perform linear or statistical profiling of program execution
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ADSP21020 | 32/40-Bit IEEE Floating-Point DSP Microprocessor |
| ADSP-21020BG-100 | 32/40-Bit IEEE Floating-Point DSP Microprocessor |
| ADSP2184 | 16 A SPDT MINIATURE POWER RELAY |
| ADSP2185 | DSP Microcomputer |
| ADSP2186 | DSP Microcomputer |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ADSP-BF561SBB600 | 功能描述:IC DSP 32BIT 600MHZ 297-BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - DSP（數(shù)字式信號(hào)處理器） 系列:Blackfin® 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI，以太網(wǎng)，RS-232 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA（20x20） 包裝:托盤 |
| ADSP-BF561SBB600 | 制造商:Analog Devices 功能描述:IC MULTIPROCESSOR |
| ADSP-BF561SBB6ENG | 制造商:Analog Devices 功能描述:- Trays |
| ADSP-BF561SBBCZ-5A | 功能描述:IC DSP CTRLR 32B 500MHZ 256CPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP（數(shù)字式信號(hào)處理器） 系列:Blackfin® 標(biāo)準(zhǔn)包裝:40 系列:TMS320DM64x, DaVinci™ 類型:定點(diǎn) 接口:I²C，McASP，McBSP 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:160kB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:0°C ~ 90°C 安裝類型:表面貼裝 封裝/外殼:548-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:548-FCBGA（27x27） 包裝:托盤 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA |
| ADSP-BF561SBBZ500 | 功能描述:IC PROCESSOR 500MHZ 297-PBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP（數(shù)字式信號(hào)處理器） 系列:Blackfin® 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI，以太網(wǎng)，RS-232 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA（20x20） 包裝:托盤 |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。