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參數資料
| 型號： | HY27US16561M |
| 廠商： | Hynix Semiconductor Inc. |
| 英文描述： | 256Mbit (32Mx8bit / 16Mx16bit) NAND Flash |
| 中文描述： | 片256Mbit（32Mx8bit / 16Mx16bit）NAND閃存 |
| 文件頁數： | 19/44頁 |
| 文件大小： | 733K |
| 代理商： | HY27US16561M |
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Rev 0.7 / Oct. 2004
19
HY27SS(08/16)561M Series
HY27US(08/16)561M Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
Reset
The Reset command is used to reset the Command Interface and Status Register. If the Reset command is issued dur-
ing any operation, the operation will be aborted. If it was a program or erase operation that was aborted, the contents
of the memory locations being modified will no longer be valid as the data will be partially programmed or erased.
If the device has already been reset then the new Reset command will not be accepted. The Ready/Busy signal goes
Low for t
BLBH4
after the Reset command is issued. The value of t
BLBH4
depends on the operation that the device was
performing when the command was issued, refer to Table 15 for the values.
Read Status Register
The device contains a Status Register which provides information on the current or previous Program or Erase opera-
tion. The various bits in the Status Register convey information and errors on the operation.
The Status Register is read by issuing the Read Status Register command. The Status Register information is present
on the output data bus (I/O
0
- I/O
7
) on the falling edge of Chip Enable or Read Enable, whichever occurs last. When
several memories are connected in a system, the use of Chip Enable and Read Enable signals allows the system to poll
each device separately, even when the Ready/Busy pins are common-wired. It is not necessary to toggle the Chip
Enable or Read Enable signals to update the contents of the Status Register.
After the Read Status Register command has been issued, the device remains in Read Status Register mode until
another command is issued. Therefore if a Read Status Register command is issued during a Random Read cycle a
new read command must be issued to continue with a Page Read or Sequential Row Read operation.
The Status Register bits are summarized in Table 6, Status Register Bits. Refer to Table 6 in conjunction with the fol-
lowing text descriptions.
Write Protection Bit (SR7)
The Write Protection bit can be used to identify if the device is protected or not. If the Write Protection bit is set to '1'
the device is not protected and program or erase operations are allowed. If the Write Protection bit is set to '0' the
device is protected and program or erase operations are not allowed.
Figure 17. Block Erase Operation
Block Address
Inputs
I/O
60h
Confirm
Code
D0h
SR0
Block Erase
Setup Code
Busy
tBLBH3
(Erase Busy time)
RB
70h
Read Status Register
相關PDF資料 |
PDF描述 |
|---|---|
| HY27US561M | 256Mbit (32Mx8bit / 16Mx16bit) NAND Flash |
| HY27SS16561M | 256Mbit (32Mx8bit / 16Mx16bit) NAND Flash |
| HY27US08561M | 256Mbit (32Mx8bit / 16Mx16bit) NAND Flash |
| HY27SSxxx | 512Mbit (64Mx8bit / 32Mx16bit) NAND Flash |
| HY27SS08121M | 512Mbit (64Mx8bit / 32Mx16bit) NAND Flash |
相關代理商/技術參數 |
參數描述 |
|---|---|
| HY27US561M | 制造商:HYNIX 制造商全稱:Hynix Semiconductor 功能描述:256Mbit (32Mx8bit / 16Mx16bit) NAND Flash |
| HY27USXXX | 制造商:HYNIX 制造商全稱:Hynix Semiconductor 功能描述:512Mbit (64Mx8bit / 32Mx16bit) NAND Flash |
| HY29DL162 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:16M(X8/X16)|3.0V DUAL BANK|70|NOR FLASH - 16M |
| HY29DL162BF-12 | 制造商:HYNIX 制造商全稱:Hynix Semiconductor 功能描述:16 Megabit (2M x 8/1M x16) Low Voltage, Dual Bank, Simultaneous Read/Write Flash Memory |
| HY29DL162BF-12I | 制造商:HYNIX 制造商全稱:Hynix Semiconductor 功能描述:16 Megabit (2M x 8/1M x16) Low Voltage, Dual Bank, Simultaneous Read/Write Flash Memory |
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