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| 型號： | P89LPC920 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 8-bit microcontrollers with two-clock 80C51 core 2 kB/4 kB/8 kB 3 V low-power Flash with 256-byte data RAM |
| 中文描述： | 8位微控制器兩個小時80C51的核心2鍵盤/ 4 KB的/ 8 KB的3伏的低功耗Flash 256 - RAM的字節(jié)數(shù)據(jù) |
| 文件頁數(shù)： | 42/45頁 |
| 文件大小： | 877K |
| 代理商： | P89LPC920 |
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Philips Semiconductors
P89LPC920/921/922
8-bit microcontrollers with two-clock 80C51 core
Product data
Rev. 06 — 21 November 2003
42 of 45
9397 750 12285
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
For packages with leads on two sides and a pitch (e):
–
larger than or equal to 1.27 mm, the footprint longitudinal axis is
preferred
to be
parallel to the transport direction of the printed-circuit board;
–
smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
°
angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250
°
C or
265
°
C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in
most applications.
14.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300
°
C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
°
C.
14.5 Package related soldering information
[1]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note
(AN01026); order a copy from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods
[2]
Table 12:
Suitability of surface mount IC packages for wave and reflow soldering
methods
Soldering method
Wave
BGA, HTSSON..T
[3]
, LBGA, LFBGA, SQFP,
SSOP..T
[3]
, TFBGA, USON, VFBGA
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
PLCC
[5]
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L
[8]
, PMFP
[9]
, WQCCN..L
[8]
Package
[1]
Reflow
[2]
suitable
not suitable
not suitable
[4]
suitable
suitable
not recommended
[5][6]
not recommended
[7]
not suitable
suitable
suitable
suitable
not suitable
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| P89LPC9201 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:8-bit microcontroller with accelerated two-clock 80C51 core 2 kB/4 kB/8 kB 3 V byte-erasable flash with 8-bit ADC |
| P89LPC9201FDH | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:8-bit microcontroller with accelerated two-clock 80C51 core 2 kB/4 kB/8 kB 3 V byte-erasable flash with 8-bit ADC |
| P89LPC9201FDH,112 | 功能描述:8位微控制器 -MCU MCU 8-Bit CISC 2KB Flash2.5V/3.3V 20Pin RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風格:SMD/SMT |
| P89LPC920FDH | 制造商:NXP Semiconductors 功能描述:MCU 8BIT 80C51 2K FLASH TSSOP20 |
| P89LPC920FDH,529 | 功能描述:8位微控制器 -MCU 80C51 2K FL 256B RAM RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風格:SMD/SMT |
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