- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄382369 > P89LPC931 8-bit microcontrollers with two-clock 80C51 core 4 kB/8 kB 3 V Flash with 256-byte data RAM PDF資料下載
參數(shù)資料
| 型號(hào)： | P89LPC931 |
| 英文描述： | 8-bit microcontrollers with two-clock 80C51 core 4 kB/8 kB 3 V Flash with 256-byte data RAM |
| 中文描述： | 8位微控制器兩個(gè)小時(shí)80C51的核心4 KB的/ 8 KB的256 3伏閃存內(nèi)存字節(jié)的數(shù)據(jù) |
| 文件頁(yè)數(shù)： | 51/54頁(yè) |
| 文件大?。?/td> | 1015K |
| 代理商： | P89LPC931 |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)當(dāng)前第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)
Philips Semiconductors
P89LPC930/931
8-bit microcontrollers with two-clock 80C51 core
Product data
Rev. 03 — 06 October 2003
51 of 54
9397 750 12122
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Hot bar soldering or manual soldering is suitable for PMFP packages.
[4]
[5]
[6]
[7]
[8]
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| P8C15416Y-12 | IC-8-BIT CMOS CPU |
| P903 | |
| P90C101ABA | 16-Bit Microcontroller |
| P90C101ABB | 16-Bit Microcontroller |
| P90CL301 | Low voltage 16-bit microcontroller |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| P89LPC9311FDH,129 | 功能描述:8位微控制器 -MCU PREF PART P89LPC931FDH RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| P89LPC9311FDH-S | 功能描述:8位微控制器 -MCU PRF PRT P89LPC931FDH RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| P89LPC931A1 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:8-bit microcontroller with accelerated two-clock 80C51 core 4 kB/8 kB 3 V byte-erasable flash |
| P89LPC931A1FDH | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:8-bit microcontroller with accelerated two-clock 80C51 core 4 kB/8 kB 3 V byte-erasable flash |
| P89LPC931A1FDH,512 | 功能描述:8位微控制器 -MCU IC 80C51 MCU FLASH 8K RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。