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參數資料
型號： S29GL032M10BFIR13
廠商： SPANSION LLC
元件分類： PROM
英文描述： MirrorBit Flash Family
中文描述： 2M X 16 FLASH 3V PROM, 100 ns, PBGA64
封裝： 13 X 11 MM, LEAD FREE, FORTIFIED BGA-64
文件頁數： 74/158頁
文件大小： 4695K
代理商： S29GL032M10BFIR13
22
S29GLxxxM MirrorBitTM Flash Family
S29GLxxxM_00_B1_E August 4, 2004
Data she e t
Table 1. S29GL032M Ordering Options
Notes:
1. Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can be packed in Types
0, 2, or 3.
2. This package is recommended for new designs using TSOPs.
3. TSOP package marking omits packing type designator from the ordering part number.
4. BGA package marking omits leading “S29” and packing type designator from the ordering part number.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales
office to confirm availability of specific valid combinations and to check on newly released combinations.
S29GL032M Valid Combinations
Package Description
Device
Number
Speed
Option
Package, Material, &
Temperature Range
Model
Number
Packing
Type
S29GL032M
90
TAC,TFC
R0
0,2,3
(note 1)
TS040 (note 2, 3)
TSOP
BAC,BFC
FBC048 (note 4)
Fine-Pitch BGA
TAC,TFC
R1,R2
TS056 (note 2, 3)
TSOP
BAC,BFC
LAA064 (note 4)
Fortified BGA
TAC,TFC
R3,R4
TS048 (note 2, 3)
TSOP
BAC,BFC
FBC048 ((note 4)
Fine-Pitch BGA
FAC,FFC
LAA064 (note 4)
Fortified BGA
10, 11
TAI,TFI
R0
TS040 (note 2, 3)
TSOP
BAI,BFI
FBC048 (note 4)
Fine-Pitch BGA
TAI,TFI
R1,R2
TS056 (note 2, 3)
TSOP
BAI,BFI
LAA064 (note 4)
Fortified BGA
TAI,TFI
R3,R4
TS048 (note 2, 3)
TSOP
BAI,BFI
FBC048 (note 4)
Fine-Pitch BGA
FAI,FFI
LAA064 (note 4)
Fortified BGA
TBI,TCI
FPT-48P-M19 (note 3)
TSOP
BAI,BFI
R5,R6
BGA-48P-M20 (note 4)
Fine-Pitch BGA
相關PDF資料
PDF描述
S29GL032M10BFIR30 T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 220uF; Working Voltage (Vdc)[max]: 6.3V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 12mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination
S29GL032M10FAIR22 MirrorBit Flash Family
S29GL032M10FAIR23 MirrorBit Flash Family
S29GL032M10FAIR30 MirrorBit Flash Family
S29GL032M10FAIR32 Tantalum Capacitor; Capacitance:220uF; Capacitance Tolerance:+/- 20 %; Working Voltage, DC:10V; Package/Case:7343-31; Terminal Type:PCB SMT; ESR:0.001ohm; Packaging:Cut Tape; Series:T530
相關代理商/技術參數
參數描述
S29GL032M10BFIR20 制造商:SPANSION 制造商全稱:SPANSION 功能描述:MirrorBit Flash Family
S29GL032M10BFIR22 制造商:SPANSION 制造商全稱:SPANSION 功能描述:MirrorBit Flash Family
S29GL032M10BFIR23 制造商:SPANSION 制造商全稱:SPANSION 功能描述:MirrorBit Flash Family
S29GL032M10BFIR30 制造商:SPANSION 制造商全稱:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology
S29GL032M10BFIR32 制造商:SPANSION 制造商全稱:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology
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