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參數資料
型號: S29GL032M10BFIR13
廠商: SPANSION LLC
元件分類: PROM
英文描述: MirrorBit Flash Family
中文描述: 2M X 16 FLASH 3V PROM, 100 ns, PBGA64
封裝: 13 X 11 MM, LEAD FREE, FORTIFIED BGA-64
文件頁數: 81/158頁
文件大小: 4695K
代理商: S29GL032M10BFIR13
August 4, 2004 S29GLxxxM_00_B1_E
S29GLxxxM MirrorBitTM Flash Family
29
Da ta shee t
Device Bus Operations
This section describes the requirements and use of the device bus operations, which are initiated through the in-
ternal command register. The command register itself does not occupy any addressable memory location. The
register is a latch used to store the commands, along with the address and data information needed to execute
the command. The contents of the register serve as inputs to the internal state machine. The state machine out-
puts dictate the function of the device. Table 1 lists the device bus operations, the inputs and control levels they
require, and the resulting output. The following subsections describe each of these operations in further detail.
Table 5. Device Bus Operations
Legend: L = Logic Low = VIL, H = Logic High = VIH, VID = 11.5–12.5 V, VHH = 11.5–12.5 V, X = Don’t Care, SA = Sector
Address, AIN = Address In, DIN = Data In, DOUT = Data Out
Notes:
1. Addresses are Amax:A0 in word mode; Amax:A-1 in byte mode. Sector addresses are Amax:A15 in both modes.
2. The sector protect and sector unprotect functions may also be implemented via programming equipment. See the
“Sector Group Protection and Unprotection” section.
3. If WP# = VIL, the first or last sector remains protected (for uniform sector devices), and the two outer boot sectors
are protected (for boot sector devices). If WP# = VIH, the first or last sector, or the two outer boot sectors will be
protected or unprotected as determined by the method described in “Sector Group Protection and Unprotection”.
All sectors are unprotected when shipped from the factory (The SecSi Sector may be factory protected depending
on version ordered.)
4. DIN or DOUT as required by command sequence, data polling, or sector protect algorithm (see Figure 2).
Operation
CE#
OE#
WE
#
RESET#
WP#
ACC
Addresses
(Note 1)
DQ0–
DQ7
DQ8–DQ15
BYTE#
= VIH
BYTE#
= VIL
Read
LL
H
X
AIN
DOUT
DQ8–DQ14
= High-Z,
DQ15 = A-1
Write (Program/Erase)
LH
L
H
(Note
3)
XAIN
(Note
4)
(Note
4)
Accelerated Program
LH
L
H
(Note
3)
VHH
AIN
(Note
4)
(Note
4)
Standby
VCC
± 0.3
V
XX
VCC ±
0.3 V
X
H
X
High-Z High-Z
High-Z
Output Disable
L
H
X
High-Z High-Z
High-Z
Reset
X
L
X
High-Z High-Z
High-Z
Sector Group Protect
(Note 2)
LH
L
VID
HX
SA, A6 =L,
A3=L, A2=L,
A1=H, A0=L
(Note
4)
XX
Sector Group
Unprotect
(Note 2)
LH
L
VID
HX
SA, A6=H,
A3=L, A2=L,
A1=H, A0=L
(Note
4)
XX
Temporary Sector
Group Unprotect
XX
X
VID
HX
AIN
(Note
4)
(Note
4)
High-Z
相關PDF資料
PDF描述
S29GL032M10BFIR30 T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 220uF; Working Voltage (Vdc)[max]: 6.3V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 12mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination
S29GL032M10FAIR22 MirrorBit Flash Family
S29GL032M10FAIR23 MirrorBit Flash Family
S29GL032M10FAIR30 MirrorBit Flash Family
S29GL032M10FAIR32 Tantalum Capacitor; Capacitance:220uF; Capacitance Tolerance:+/- 20 %; Working Voltage, DC:10V; Package/Case:7343-31; Terminal Type:PCB SMT; ESR:0.001ohm; Packaging:Cut Tape; Series:T530
相關代理商/技術參數
參數描述
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