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| 型號(hào)： | TMDS442PNPRG4 |
| 廠(chǎng)商： | TEXAS INSTRUMENTS INC |
| 元件分類(lèi)： | 消費(fèi)家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, PQFP128 |
| 封裝： | PLASTIC, TQFP-128 |
| 文件頁(yè)數(shù)： | 32/45頁(yè) |
| 文件大小： | 1977K |
| 代理商： | TMDS442PNPRG4 |
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www.ti.com
PACKAGE OPTION ADDENDUM
PACKAGING INFORMATION 30-August-2006
SLLS757A – AUGUST 2006 – REVISED MARCH 2007
Orderable Device
Package
Pins
Package
Lead/Ball Finish
Status
(1)
Eco Plan
(2)
MSL Peak Temp
(3)
Type
Drawing
Qty
TMDS442PNP
ACTIVE
HTQFP
PNP
128
90
Green (RoHS & no
CU NIPDAU
Level-3-260C-168 HR
Sb/Br)
TMDS442PNPG4
ACTIVE
HTQFP
PNP
128
90
Green (RoHS & no
CU NIPDAU
Level-3-260C-168 HR
Sb/Br)
1. The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI
does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
2. Eco Plan -The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green
(RoHS & no Sb/Br) -please check http://www.ti.com/productcontent for the latest availability information and
additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with
the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by
weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products
are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder
bumps used between the die and package, or 2) lead-based die adhesive used between the die and
leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine
(Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous
material)
3. MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard
classifications, and peak solder temperature.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and
belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties,
and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better
integrate information from third parties. TI has taken and continues to take reasonable steps to provide
representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus
CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at
issue in this document sold by TI to Customer on an annual basis.
38
Copyright 2006–2007, Texas Instruments Incorporated
Product Folder Link(s): TMDS442
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