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參數資料
型號： TSB12C01APZ
廠商： Texas Instruments, Inc.
英文描述： High-Speed Serial-Bus Link-Layer Controller
中文描述： 高速串行總線鏈路層控制器
文件頁數： 41/59頁
文件大小： 275K
代理商： TSB12C01APZ
5–1
5 Electrical Characteristics
5.1
Absolute Maximum Ratings Over Free-Air Temperature Range (Unless
Otherwise Noted)
Supply voltage range, V
CC
(see Note 1)
Input voltage range, at any input, V
I
Output voltage range, V
O
Input clamp current, I
IK
(V
I
< 0 or V
I
> V
CC
) (see Note 2)
Continuous total power dissipation
Output clamp current, I
OK
(V
O
< 0 or V
O
> V
CC
) (see Note 3)
Operating free-air temperature range, T
A
: A suffix
–0.5 V to 6 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
–0.5 V to V
CC
+ 0.5 V
–0.5 V to V
CC
+ 0.5 V
. . . . . . . . . . . . . . . . . .
See Maximum Dissipation Rating Table
. . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . .
AI suffix
. . . . . . . . . . . . . . . . . .
AM suffix
. . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
20 mA
. . . . . . . . . .
±
20 mA
0
°
C to 70
°
C
–40
°
C to 85
°
C
–55
°
C to 125
°
C
–65
°
C to 150
°
C
Storage temperature range, T
stg
Case temperature for 10 seconds, T
C
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These
are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated
under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for
extended periods may affect device reliability.
NOTES:
1. All voltage values are with respect to GND.
2. This applies to all inputs.
3. This applies to all outputs.
260
°
C
MAXIMUM DISSIPATION RATING TABLE
PACKAGE
TA
≤
25
°
C
POWER RATING
DERATING
FACTOR
ABOVE TA = 25
°
C
16.9 mW/
°
C
19.2 mW/
°
C
TA = 70
°
C
POWER RATING
TA = 85
°
C
POWER RATING
TA = 125
°
C
POWER RATING
PZ
WN
2119 mW
2404 mW
1356 mW
1538 mW
1102 mW
1250 mW
—
481 mW
Power dissipation of package based on an absolute maximum junction temperature of 150
°
C.
PACKAGE THERMAL CHARACTERISTICS§
PARAMETER
TEST
PZ PACKAGE
MIN
NOM
WN PACKAGE
MIN
NOM
UNIT
CONDITIONS
MAX
MAX
R
θ
JA
Junction-to-ambient thermal
impedance
Board mounted,
No air flow
59
52
°
C/W
R
θ
JC
Junction-to-case thermal
impedance
§Thermal characteristics very depending on die and leadframe pad size as well as mold compound. These values
represent typical die and pad sizes for the respective packages. The R value decreases as the die or pad sizes
increases. Thermal values represent PWB bands with minimal amounts of metal.
13
8
°
C/W
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