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參數(shù)資料
型號: UDA1352HL
廠商: NXP SEMICONDUCTORS
元件分類: 消費(fèi)家電
英文描述: 48 kHz IEC 60958 audio DAC
中文描述: SPECIALTY CONSUMER CIRCUIT, PQFP48
封裝: 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-313-2, LQFP-48
文件頁數(shù): 2/64頁
文件大小: 262K
代理商: UDA1352HL
2003 Mar 25
2
Philips Semiconductors
Preliminary specification
48 kHz IEC 60958 audio DAC
UDA1352HL
CONTENTS
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
8.2
8.3
8.4
8.5
8.6
8.7
9
9.1
9.2
9.3
9.4
9.5
9.6
10
10.1
10.2
10.3
10.4
10.5
10.6
10.7
10.8
10.9
10.10
10.11
11
11.1
11.2
11.3
11.4
FEATURES
General
Control
IEC 60958 input
Digital sound processing and DAC
APPLICATIONS
GENERAL DESCRIPTION
ORDERING INFORMATION
QUICK REFERENCE DATA
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
Operating modes
Clock regeneration and lock detection
Crystal oscillator
Mute
Auto mute
Data path
Control
L3-BUS DESCRIPTION
General
Device addressing
Register addressing
Data write mode
Data read mode
Initialization string
I
2
C-BUS DESCRIPTION
Characteristics of the I
2
C-bus
Bit transfer
Byte transfer
Data transfer
Start and stop conditions
Acknowledgment
Device address
Register address
Write and read data
Write cycle
Read cycle
SPDIF SIGNAL FORMAT
SPDIF channel encoding
SPDIF hierarchical layers for audio data
SPDIF hierarchical layers for digital data
Timing characteristics
12
12.1
12.2
12.3
12.4
12.5
12.6
REGISTER MAPPING
Clock settings (write)
I
2
S-bus output settings (write)
I
2
S-bus input settings (write)
Power-down settings (write)
Volume control left and right (write)
Sound feature mode, treble and bass boost
settings (write)
De-emphasis and mute (write)
DAC source and clock settings (write)
SPDIF input settings (write)
Supplemental settings (write)
PLL coarse ratio (write)
Interpolator status (read-out)
SPDIF status (read-out)
Channel status (read-out)
PLL status (read-out)
LIMITING VALUES
THERMAL CHARACTERISTICS
CHARACTERISTICS
TIMING CHARACTERISTICS
APPLICATION INFORMATION
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
PURCHASE OF PHILIPS I
2
C COMPONENTS
12.7
12.8
12.9
12.10
12.11
12.12
12.13
12.14
12.15
13
14
15
16
17
18
19
19.1
19.2
19.3
19.4
19.5
20
21
22
23
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