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參數資料
| 型號： | UDA1384 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Multichannel audio coder-decoder |
| 中文描述： | 多聲道音頻編碼解碼器 |
| 文件頁數： | 51/55頁 |
| 文件大小： | 276K |
| 代理商： | UDA1384 |
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9397 750 14366
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 17 January 2005
51 of 55
Philips Semiconductors
UDA1384
Multichannel audio coder-decoder
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
–
larger than or equal to 1.27 mm, the footprint longitudinal axis is
preferred
to be
parallel to the transport direction of the printed-circuit board;
–
smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
°
angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250
°
C
or 265
°
C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
19.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300
°
C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270
°
C and 320
°
C.
19.5 Package related soldering information
[1]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note(AN01026);
order a copy from your Philips Semiconductors sales office.
Table 68:
Package
[1]
Suitability of surface mount IC packages for wave and reflow soldering methods
Soldering method
Wave
BGA, HTSSON..T
[3]
, LBGA, LFBGA, SQFP,
SSOP..T
[3]
, TFBGA, VFBGA, XSON
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
PLCC
[5]
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L
[8]
, PMFP
[9]
, WQCCN..L
[8]
Reflow
[2]
suitable
not suitable
not suitable
[4]
suitable
suitable
not recommended
[5] [6]
not recommended
[7]
not suitable
suitable
suitable
suitable
not suitable
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相關代理商/技術參數 |
參數描述 |
|---|---|
| UDA1384H | 功能描述:編碼器、解碼器、復用器和解復用器 LO CST MULTICH CODEC RoHS:否 制造商:Micrel 產品:Multiplexers 邏輯系列:CMOS 位數: 線路數量（輸入/輸出）:2 / 12 傳播延遲時間:350 ps, 400 ps 電源電壓-最大:2.625 V, 3.6 V 電源電壓-最小:2.375 V, 3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Tray |
| UDA1384H/N1,518 | 功能描述:編碼器、解碼器、復用器和解復用器 LOW COST MULTICHANNEL CODEC RoHS:否 制造商:Micrel 產品:Multiplexers 邏輯系列:CMOS 位數: 線路數量（輸入/輸出）:2 / 12 傳播延遲時間:350 ps, 400 ps 電源電壓-最大:2.625 V, 3.6 V 電源電壓-最小:2.375 V, 3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Tray |
| UDA1384H/N1,557 | 功能描述:編碼器、解碼器、復用器和解復用器 LOW COST MULTICHANNEL CODEC RoHS:否 制造商:Micrel 產品:Multiplexers 邏輯系列:CMOS 位數: 線路數量（輸入/輸出）:2 / 12 傳播延遲時間:350 ps, 400 ps 電源電壓-最大:2.625 V, 3.6 V 電源電壓-最小:2.375 V, 3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Tray |
| UDA1384H-T | 功能描述:編碼器、解碼器、復用器和解復用器 LO CST MULTICH CODEC RoHS:否 制造商:Micrel 產品:Multiplexers 邏輯系列:CMOS 位數: 線路數量（輸入/輸出）:2 / 12 傳播延遲時間:350 ps, 400 ps 電源電壓-最大:2.625 V, 3.6 V 電源電壓-最小:2.375 V, 3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Tray |
| UDA1431T | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:16-bit, 48 kHz, low-cost stereo current DAC |
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