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參數資料
型號: 575703B00000G
廠商: Aavid Thermalloy
文件頁數: 48/116頁
文件大小: 0K
描述: BOARD LEVEL HEAT SINK
產品培訓模塊: How to Select a Heat Sink
標準包裝: 1,000
類型: 插件板級
冷卻式包裝: TO-3
固定方法: 把緊螺栓
形狀: 菱形
長度: 1.630"(41.40mm)
寬: 1.290"(32.77mm)
機座外的高度(散熱片高度): 0.750"(19.05mm)
溫升時的功耗: 2W @ 30°C
在強制氣流下的熱敏電阻: 在 200 LFM 時為4.0°C/W
自然環境下的熱電阻: 13.4°C/W
材質:
材料表面處理: 黑色陽極化處理
其它名稱: 002341
37
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
6238, 6239
Channel style heat sink with integrated clip
Channel style heat sink with
integrated clip features strong
spring tension and device lock-
ing tab to attach device securely
to the heat sink. Available with
solderable tabs for vertical
mount or without tabs for
mounting horizontally.
10.80
(0.425)
24.38
(0.960)
2.67
(0.105)
15.49
(0.610)
25.53
(1.005)
5.08
(0.200)
8.00
(0.315)
"A"
2.02
(0.080)
B
3.17
(0.125)
19.05
(0.750)
1.90
(0.075)
16.51
(0.650)
SECTION B-B
AT BASE
TAB
Part Number
Description
“A” Dim
6238BG
Channel heat sink with integral clip, no solderable tab
6238B-MTG
With solderable mounting tabs
10.16 (0.400)
2.90 (0.114)
6239B-MTG
With solderable mounting tabs
6.99 (0.275)
2.90 (0.114)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
10
0
20
40
60
80
100
0
1
2
3
4
5
8
6
2
4
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
5342
Channel style heat sink with convenient clip
Material: 1.02 (0.040) Thick Aluminum
Finish: Black Anodize
TO-220 Heat Sinks
Dia of PCB
Plated Thru
Hole for Tabs
ORDERING INFORMATION
Channel style heat sink features
a dittin to locate the device and
a convenient clip to eliminate the
need for mounting hardware. The
twisted fins increase cooling effi-
ciency. Available in two solderable
mounting tab styles. Can be ordered
without the ditton if electrical isola-
tion is required or for mounting
tabless packages.
25.40
(1.000)
17.78
(0.700)
3.12
(0.123)
22.35
(0.880)
12.70
(0.500)
9.27
(0.365)
1.60
(0.063)
29.97
(1.180)
0.762
(0.030)
9.78
(0.385)
CL
14.12
(0.556)
“A”
Part Number
Description
Figure
“A” Dim
534202B02853G
With Shur-LockTM tabs and clip
A
Dia 3.05(0.120) x 0.64(0.025) High Dittin
2.39 (0.094)
534202B03453G
With solderable mounting tabs and clip
B
Dia 3.05(0.120) x 0.64(0.025) High Dittin
2.39 (0.094)
534265B02853G
With Shur-LockTM tabs and clip
A
No Dittin
2.39 (0.094)
534265B03453G
With solderable mounting tabs and clip
B
No Dittin
2.39 (0.094)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
10
0
20
40
60
80
100
02
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
17.78
(0.700)
4.27
(0.170)
23.93
(0.942)
12.70
(0.500)
10.16
(0.400)
1.90
(0.075)
29.97
(1.180)
0.81
(0.032)
9.78
(0.385)
CL
25.40
(1.000)
14.12
(0.556)
“A”
FIGURE A
FIGURE B
12.06
(0.475)
3.96
(0.156)
3.17
(0.125)
13.84
(0.545)
CLIP 53
For additional options see page 85
Dia of PCB
Plated Thru
Hole for Tabs
For additional options see page 82
Grease
Epoxy
&
page112
Mounting
Kits
page 99
相關PDF資料
PDF描述
CSL-38-31010 RELAY GEN PURPOSE DPDT 10A 24V
SOMC1401100RGEA RES ARRAY 100 OHM 13 RES 14SOIC
SOMC1603820RGEA RES ARRAY 820 OHM 8 RES 16-SOIC
SOMC160368K0GEA RES ARRAY 68K OHM 8 RES 16-SOIC
579103B00000G HEATSINK TO-3 BLACK .87"
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575703B00300G 功能描述:BOARD LEVEL HEAT SINK RoHS:是 類別:風扇,熱管理 >> 熱敏 - 散熱器 系列:- 產品目錄繪圖:BDN12-3CB^A01 標準包裝:300 系列:BDN 類型:頂部安裝 冷卻式包裝:分類(BGA,LGA,CPU,ASIC……) 固定方法:散熱帶,粘合劑(含) 形狀:方形,鰭片 長度:1.21"(30.73mm) 寬:1.210"(30.73mm) 直徑:- 機座外的高度(散熱片高度):0.355"(9.02mm) 溫升時的功耗:- 在強制氣流下的熱敏電阻:在 400 LFM 時為6.8°C/W 自然環境下的熱電阻:19.6°C/W 材質:鋁 材料表面處理:黑色陽極化處理 產品目錄頁面:2681 (CN2011-ZH PDF) 其它名稱:294-1099
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