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參數資料
型號: 575703B00000G
廠商: Aavid Thermalloy
文件頁數: 52/116頁
文件大小: 0K
描述: BOARD LEVEL HEAT SINK
產品培訓模塊: How to Select a Heat Sink
標準包裝: 1,000
類型: 插件板級
冷卻式包裝: TO-3
固定方法: 把緊螺栓
形狀: 菱形
長度: 1.630"(41.40mm)
寬: 1.290"(32.77mm)
機座外的高度(散熱片高度): 0.750"(19.05mm)
溫升時的功耗: 2W @ 30°C
在強制氣流下的熱敏電阻: 在 200 LFM 時為4.0°C/W
自然環境下的熱電阻: 13.4°C/W
材質:
材料表面處理: 黑色陽極化處理
其它名稱: 002341
40
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
5306, 5307, 5760
Channel style heat sink with wide mounting surface
Lightweight, low cost channel style
heat sink with wide mounting surface
and selection of lengths to accept a
variety of packages. Models accomodate
one or two devices.
"C"
AT BASE
25.40
(1.000)
THRU
3.81
(0.150)
"B"
"A"
CL
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
10
0
20
40
60
80
100
01
2
3
4
5
8
6
2
4
0
400
200
600
800
1000
530613 or 530614
576012, 530714 or 576014
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
Part Number
Figure
“A” Dim
“B” Dim
“C” Dim
530613B00000G
B
12.19 (0.480)
10.16 (0.400)
530614B00000G
A
29.97 (1.180)
11.68 (0.460)
12.70 (0.500)
530714B00000G
A
18.03 (0.710)
12.32 (0.485)
12.70 (0.500)
576012B00000G
A
22.86 (0.900)
11.43 (0.450)
9.65 (0.380)
576014B00000G
A
22.86 (0.900)
8.13 (0.320)
9.65 (0.380)
ORDERING INFORMATION
12.70
(0.500)
29.97
(1.180)
AT BASE
25.40
(1.000)
THRU 2X
3.81
(0.150)
"A"
"B"
CL
FIGURE A
FIGURE B
For additional options see page 82
5779, 5786
Twin channel style heat sink
vertically mounts two TO-220 devices
to a single heat sink. Center fins
increase cooling capacity. Available
with integrated twist tabs or staked
on solder tabs for easy attachment
to the PC board.
37.59
(1.480)
12.70
(0.500)
2.54
(0.100)
5.08
(0.200)
26.16
(1.030)
19.30
(0.760)
30.15
(1.187)
3.81
(0.150)
THRU
TYP 2
9.65
(0.380)
TYP 2
15.49
(0.610)
TYP 2
3.81
(0.150)
THRU
TYP 2
37.59
(1.480)
12.70
(0.500)
14.99
(0.590)
35.56
(1.400)
9.65
(0.380)
TYP 2
19.30
(0.760)
5.59
(0.220)
1.57
(0.062)
3.43
(0.135)
12.70
(0.500)
25.40
(1.000)
ORDERING INFORMATION
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
10
0
20
40
60
80
100
0
1
2
3
4
5
8
6
2
4
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Part Number
Description
Figure
577922B00000G
Twin channel style heat sink with integrated tabs
A
3.10 (0.122)
578622B03200G
With staked on solderable tabs
B
1.91 (0.075)
Dia of PCB
Plated Thru
Hole for Tabs
FIGURE A
FIGURE B
For additional options see page 82
TO-220 Heat Sinks
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
相關PDF資料
PDF描述
CSL-38-31010 RELAY GEN PURPOSE DPDT 10A 24V
SOMC1401100RGEA RES ARRAY 100 OHM 13 RES 14SOIC
SOMC1603820RGEA RES ARRAY 820 OHM 8 RES 16-SOIC
SOMC160368K0GEA RES ARRAY 68K OHM 8 RES 16-SOIC
579103B00000G HEATSINK TO-3 BLACK .87"
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575703B00300G 功能描述:BOARD LEVEL HEAT SINK RoHS:是 類別:風扇,熱管理 >> 熱敏 - 散熱器 系列:- 產品目錄繪圖:BDN12-3CB^A01 標準包裝:300 系列:BDN 類型:頂部安裝 冷卻式包裝:分類(BGA,LGA,CPU,ASIC……) 固定方法:散熱帶,粘合劑(含) 形狀:方形,鰭片 長度:1.21"(30.73mm) 寬:1.210"(30.73mm) 直徑:- 機座外的高度(散熱片高度):0.355"(9.02mm) 溫升時的功耗:- 在強制氣流下的熱敏電阻:在 400 LFM 時為6.8°C/W 自然環境下的熱電阻:19.6°C/W 材質:鋁 材料表面處理:黑色陽極化處理 產品目錄頁面:2681 (CN2011-ZH PDF) 其它名稱:294-1099
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